IEC 62137-1-1 : 1.0

Current

Current The latest, up-to-date edition.

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-1: PULL STRENGTH TEST

Publisher: International Electrotechnical Committee

Published:

Available Formats: PDF - English - French, Hardcopy - English - French, PDF - English, Hardcopy - English
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Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test equipment and materials
   5.1 Flow soldering equipment
   5.2 Reflow soldering equipment
   5.3 Pull strength test equipment
   5.4 Optical microscope
   5.5 Test substrate
   5.6 Solder alloy
   5.7 Flux for flow soldering
   5.8 Solder paste
6 Mounting method
   6.1 Flow soldering
   6.2 Reflow soldering
7 Test conditions
   7.1 Test: Rapid change of temperature
   7.2 Pull strength test
8 Test procedure
   8.1 Test sequence
   8.2 Pre-conditioning
   8.3 Initial pull strength measurement
   8.4 Rapid change of temperature
   8.5 Recovery
   8.6 Intermediate/final pull strength measurement
9 Items to be included in the test report
10 Items to be given in the product specification
Annex A (normative) Pull strength test - Details
Bibliography

Abstract - (Show below) - (Hide below)

Applies to gull-wing lead surface mounting components. It is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress.

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Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
DS EN 62137-1-1 : 2007	Identical
NF EN 62137-1-1 : 2014	Identical
NEN EN IEC 62137-1-1 : 2007	Identical
I.S. EN 62137-1-1:2007	Identical
PN EN 62137-1-1 : 2008	Identical
UNE-EN 62137-1-1:2007	Identical
BS EN 62137-1-1 : 2007	Identical
CEI EN 62137-1-1 : 2008	Identical
EN 62137-1-1 : 2007	Identical
DIN EN 62137-1-1 : 2008	Identical
NEN EN IEC 62137-1-1 : 2007	Identical
I.S. EN 62137-1-1:2007	Identical
JIS C 62137-1-1:2010	Identical
DIN EN 62137-1-1 : 2008	Identical
DS EN 62137-1-1 : 2007	Identical
BS EN 62137-1-1 : 2007	Identical
PN EN 62137-1-1 : 2008	Identical
CEI EN 62137-1-1 : 2008	Identical
UNE-EN 62137-1-1:2007	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

12/30254691 DC : DRAFT MAR 2012	BS ISO 16525-7 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS
BS EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
DD IEC PAS 62137-3 : DRAFT 2008	ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
09/30206176 DC : DRAFT JUNE 2009	BS EN 62137-3 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
NF EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
CEI EN 62137-3 : 2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
ISO 16525-7 : 2014	ADHESIVES - TEST METHODS FOR ISOTROPIC ELECTRICALLY CONDUCTIVE ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS
I.S. EN 62137-3:2012	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS (IEC 62137-3:2011 (EQV))
BS ISO 16525-7 : 2014	ADHESIVES - TEST METHODS FOR ISOTROPIC ELECTRICALLY CONDUCTIVE ADHESIVES - PART 7: ENVIRONMENTAL TEST METHODS
IEC PAS 62137-3 : 1.0	ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
IEC 62137-3 : 1.0	ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60068-1 : 7.0	ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE
IEC 61190-1-2 : 3.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
IEC 61249-2-7 : 1.0	MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 60068-2-21 : 6.0	ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES
IEC 61760-1 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61190-1-1 : 1.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
IEC 60194 : 6.0	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
IEC 61188-5-5 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
IEC 60068-2-14 : 6.0	ENVIRONMENTAL TESTING - PART 2-14: TESTS - TEST N: CHANGE OF TEMPERATURE
IEC 61190-1-3 : 2.1	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

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IEC 62137-1-1 : 1.0

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

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