• IEC 62258-2:2011

    Current The latest, up-to-date edition.

    Semiconductor die products - Part 2: Exchange data formats

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  25-05-2011

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Requirements
    5 Device Data eXchange format (DDX) file goals and usage
    6 DDX file format and file format rules
    7 DDX file content
    8 Definitions of DEVICE block parameters
    Annex A (informative) - An example of a DDX DEVICE block
    Annex B (informative) - Groups and Permutation
    Annex C (informative) - A Typical CAD view from the DDX file
                            block example given in Annex A
    Annex D (informative) - Properties for Simulation
    Annex E (informative) - TERMINAL and TERMINAL_TYPE
                            graphical usage for CAD/CAM systems
    Annex F (informative) - Cross-reference with IEC 61360-4
    Annex G (informative) - Notes on VERSION and NAME
                            parameters
    Annex H (informative) - Notes on WAFER parameters
    Annex I (informative) - Additional notes
    Annex J (informative) - DDX Version history
    Annex K (informative) - Parse Control

    Abstract - (Show below) - (Hide below)

    IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition.

    This publication is to be read in conjunction with IEC 62258-1:2009.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note To be read in conjunction with IEC 62258-1. (06/2005) Stability Date: 2015. (10/2012)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    CEI CLC/TR 62258-7 : 2009 SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
    06/30123954 DC : DRAFT MAR 2006
    BS EN 62258-5:2006 Semiconductor die products Requirements for information concerning electrical simulation
    04/30110525 DC : DRAFT MARCH 2004 IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    IEC TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
    CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
    BS EN 62258-1:2010 Semiconductor die products Procurement and use
    06/30146849 DC : DRAFT FEB 2006 IEC TR 62258-7 - SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
    CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
    I.S. EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
    S.R. CLC/TR 62258-4:2013 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS (IEC/TR 62258-4:2012 (EQV))
    05/30130553 DC : DRAFT MAR 2005 IEC 62258-5 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
    PD CLC/TR 62258-3:2007 Semiconductor die products Recommendations for good practice in handling, packing and storage
    PD IEC/TR 62258-4:2007 Semiconductor die products Questionnaire for die users and suppliers
    S.R. TR 62258-7:2007 SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
    I.S. EN 62258-5:2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
    CEI CLC/TR 62258-8 : 2009 SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE
    IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
    CEI EN 62258-5 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
    PD CLC/TR 62258-4:2013 Semiconductor die products Questionnaire for die users and suppliers
    CEI CLC/TR 62258-4 : 2013 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
    PD IEC/TR 62258-7:2007 Semiconductor die products XML schema for data exchange
    IEC TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
    S.R. TR 62258-4:2007 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
    PD IEC/TR 62258-8:2008 Semiconductor die products EXPRESS model schema for data exchange
    05/30130559 DC : DRAFT MAR 2005 IEC 62258-6 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
    CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
    IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
    BS PD IEC TR 62258-3 : 2005 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    05/30127455 DC : DRAFT JAN 2005 IEC 62258-4 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
    BS EN 62258-6:2006 Semiconductor die products Requirements for information concerning thermal simulation
    CEI EN 62258-6 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
    I.S. CLC/TR 62258-3:2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    I.S. EN 62258-6:2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
    CEI CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    S.R. CLC/TR 62258-8:2008 SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61360-4:2005 Standard data element types with associated classification scheme for electric components - Part 4: IEC reference collection of standard data element types and component classes
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    ISO 6093:1985 Information processing Representation of numerical values in character strings for information interchange
    ISO 8601:2004 Data elements and interchange formats Information interchange Representation of dates and times
    ISO 10303-21:2002 Industrial automation systems and integration Product data representation and exchange Part 21: Implementation methods: Clear text encoding of the exchange structure
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