• IEC 62421:2007

    Current The latest, up-to-date edition.

    Electronics assembly technology - Electronic modules

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English, English - French

    Published date:  24-08-2007

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Business model and interface between supplier and user
      4.1 Business model
          4.1.1 General
          4.1.2 E-type business model
          4.1.3 M-type business model
          4.1.4 F-type business model
      4.2 S-U interface
          4.2.1 S-U interface-1
          4.2.2 S-U interface-2
          4.2.3 S-U interface-3
      4.3 Standardization areas
    5 Preferred ratings
      5.1 General
      5.2 Preferred operating temperature range
      5.3 Preferred rated voltage
    6 Tests and measuring methods
      6.1 Standard atmospheric conditions
          6.1.1 Standard atmospheric conditions for testing
          6.1.2 Referee conditions
          6.1.3 Reference conditions
      6.2 Electrical performance tests
          6.2.1 General
          6.2.2 Protection of electronic modules and test
                equipment
          6.2.3 Accuracy of measurement
      6.3 Mechanical performance tests
          6.3.1 Robustness of terminations and integral
                mounting devices
          6.3.2 Resistance to soldering heat
          6.3.3 Solderability
          6.3.4 Shock
          6.3.5 Vibration (sinusoidal)
          6.3.6 Resistance to solvents
      6.4 Climatic performance tests
          6.4.1 Dry heat
          6.4.2 Cold
          6.4.3 Damp heat, steady state
          6.4.4 Change of temperature

    Abstract - (Show below) - (Hide below)

    IEC 62421:2007 provides a generic standard of electronic modules on which their sectional standards are based. It provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability Date: 2020. A Bilingual edition has been published on 05/03/2014. (03/2014)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TS 62878-2-1:2015 Device embedded substrate Guidelines. General description of technology
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    I.S. EN 61193-2:2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
    BS EN 61193-2:2007 Quality assessment systems Selection and use of sampling plans for inspection of electronic components and packages
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    PD IEC/TS 62878-2-3:2015 Device embedded substrate Guidelines. Design guide
    IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
    EN 61193-2 : 2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
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