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  • IEC 62483:2013

    Current The latest, up-to-date edition.

    Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  25-09-2013

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Terms and definitions
    3 Test method for measuring tin whisker
      growth
    4 Acceptance procedure for tin and tin alloy
      surface finishes
    5 Acceptance criteria
    6 Reporting of results
    7 On-going tin whisker evaluation
    Annex A (normative) - Test method for measuring
            whisker growth on tin and tin alloy
            surface finishes of semiconductor devices
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 62483:2013 describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This first edition is based on JEDEC documents JESD201A and JESD22-A121A and replaces IEC/PAS 62483, published in 2006. This first edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
    a) The content of IEC/PAS 62483 was added to the content of JESD201A as Annex A.
    b) A methodology was introduced for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers.
    c) A Clause 6 was introduced detailing the reporting requirements of test results.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC PAS 62483. Stability date: 2021. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
    16/30344800 DC : 0 BS EN 60749-3 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    CEI EN 60749-3 : 2004 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
    BS EN 60749-3:2017 Semiconductor devices. Mechanical and climatic test methods External visual examination
    I.S. EN 60749-3:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
    IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
    PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC JP002 : 0 JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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