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Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
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Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users
Superseded date: 25-02-2010
Language(s): English
Published date: 22-01-2008
Publisher: International Electrotechnical Committee
FOREWORD1 Scope2 Normative references 3 Terms and definitions 4 Sample 4.1 Sample size 4.2 Solder ball removal 4.3 Pre-treatment conditions 4.4 Maximum time after pretreatment until measurement 4.5 Repetition of the reflow cycles for the sample5 Measurement 5.1 General description 5.2 Temperature profile and the temperatures for measurements 5.3 Measurement method6 Maximum permissible package warpage at elevated temperature 7 Recommended datasheet for the package warpage 7.1 Measurement temperatures for data sheet 7.2 Data sheet 7.3 Example of data sheets Annex A (informative) Explanatory notes Bibliography
This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
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