• IEC PAS 60191-6-19:2008

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  25-02-2010

    Language(s):  English

    Published date:  22-01-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Sample
      4.1 Sample size
      4.2 Solder ball removal
      4.3 Pre-treatment conditions
      4.4 Maximum time after pretreatment until measurement
      4.5 Repetition of the reflow cycles for the sample
    5 Measurement
      5.1 General description
      5.2 Temperature profile and the temperatures for measurements
      5.3 Measurement method
    6 Maximum permissible package warpage at elevated temperature
    7 Recommended datasheet for the package warpage
      7.1 Measurement temperatures for data sheet
      7.2 Data sheet
      7.3 Example of data sheets
    Annex A (informative) Explanatory notes
    Bibliography

    Abstract - (Show below) - (Hide below)

    This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

    General Product Information - (Show below) - (Hide below)

    Document Type Miscellaneous Product
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
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