• IEC PAS 61249-3-1:2007

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  31-12-2021

    Language(s):  English

    Published date:  30-05-2007

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Designation of copper-clad laminates
      4.1 Copper-clad laminate
      4.2 Base materials
      4.3 Thickness of the base material
      4.4 Types of adhesives
      4.5 Thickness of base materials and adhesives
      4.6 Type of copper foil
      4.7 Grade of copper foil
      4.8 Copper-foil thickness
      4.9 Types of profiles
      4.10 Surface treatment to increase copper adhesivity
           and anti-rust
      4.11 Symbol for flammability
    5 Observation
      5.1 Base film
      5.2 Copper foil
      5.3 CCL
    6 Size
      6.1 Base film
           6.1.1 Thickness and its allowance
      6.2 Copper foil
           6.2.1 Thickness and its allowance
      6.3 Adhesives
           6.3.1 Adhesives
      6.4 Copper-clad laminates
           6.4.1 Thickness and its allowance
           6.4.2 Sheet dimension and its allowance
           6.4.3 Role dimension and its allowance
    7 Properties
      7.1 Base film
      7.2 Copper foil
      7.3 CCL
    8 Package and labelling
    Annex A (normative) Roughness test
    Annex B (normative) Dimensional stability test
    Appendix - Additional information

    Abstract - (Show below) - (Hide below)

    Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2013. (10/2012)
    Document Type Miscellaneous Product
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IPC 4204 : A FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY
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