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  • IEC PAS 62137-3:2008

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  08-11-2011

    Language(s):  English

    Published date:  13-11-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Procedure of selecting the applicable test method
      4.1 Stress to solder joints in the field and test methods
      4.2 Selection of test methods based on the shapes and
          terminals of electronic components
    5 Common subjects in each test method
      5.1 Mounting device and materials used
      5.2 Soldering condition
      5.3 Accelerated endurance test
      5.4 Selection of test conditions and analysis of test
          results
    6 Test method
      6.1 Body strength test of SMD before and after the rapid
          temperature change test
      6.2 Cyclic bending strength test
      6.3 Mechanical shear fatigue test
      6.4 Cyclic drop test
      6.5 Strength test of leaded component
      6.6 Fillet lifting phenomenon observation of leaded
          component
    Annex A (informative) Condition of rapid temperature
            change test
    Annex B (informative) Soldered joint test by electrical
            conduction
    Annex C (informative) Torque shear strength test
    Annex D (informative) Monotonic bending strength test
    Annex E (informative) Cyclic steel ball drop strength test
    Annex F (informative) Pull strength test
    Annex G (informative) Creep strength test
    Annex H (informative) Fillet lifting phenomenon observation
            of leaded component solder joint and the life test
            by electrical conduction

    Abstract - (Show below) - (Hide below)

    IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

    General Product Information - (Show below) - (Hide below)

    Document Type Miscellaneous Product
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    11/30252855 DC : 0 BS EN 60068-3-13 - ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T: SOLDERING

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
    IEC 62137:2004 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
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