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  • IEC PAS 62647-2:2011

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  29-11-2012

    Language(s):  English

    Published date:  22-06-2011

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Terms and definitions
    3 Requirements
    Annex A (informative) - Guidance on control levels, risk
                            assessment, and mitigation evaluation
    Annex B (informative) - Technical guide on tin whiskers
    Annex C (informative) - Technical guide on detection
                            methods, mitigation methods, and
                            methods for limiting impact of tin
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC/PAS 62647-2:2011(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of tin finishes in electronic systems. This PAS is applicable to aerospace and high performance electronic applications which procure equipment that may contain Pb-free tin finishes.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2014. (10/2012)
    Document Type Miscellaneous Product
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC PAS 62647-21:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
    DD IEC PAS 62647-3 : DRAFT SEP 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES

    Standards Referencing This Book - (Show below) - (Hide below)

    NASA STD 8739.1 : 2016 WORKMANSHIP STANDARD FOR POLYMERIC APPLICATION ON ELECTRONIC ASSEMBLIES
    IPC JP002 : 0 JEDEC/IPC CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
    IPC CC 830 : B QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES
    MIL-I-46058 Revision C:1972 Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
    ASTM B 545 : 2013 : REDLINE Standard Specification for Electrodeposited Coatings of Tin
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
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