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  • IEC PAS 62647-21:2011

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  26-07-2013

    Language(s):  English

    Published date:  28-07-2011

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Symbols and abbreviated terms
    5 General discussion of program management/systems
       engineering management concerns
    6 Requirements definition
    7 Use environment(s)
    8 Decision criteria
    9 Suppliers lead-free control plan
    10 Requalification/test plan
    11 Rework/repair and maintenance
    12 Risk management
    13 Cost
    14 Presentation to customer
    Annex A (informative) - Matrix of tier level versus
                            associated risk
    Annex B (informative) - Links to the European Union
                            Directives and Executive
                            Order 13148
    Annex C (informative) - General program manager checklist
                            for dealing with Pb-free issues
    Annex D (informative) - General manufacturing process
                            assessment checklist for assessing
                            supplier compliance to IEC/PAS 62647-1
                            (GEIA-STD-0005-1)
    Annex E (informative) - Recommended program language
                            (subject to contractual agreements)
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC/PAS 62647-21:2011(E) is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance.

    This publication is to be read in conjunction with IEC/PAS 62647-1:2011 and IEC/PAS 62647-2:2011.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2014. (10/2012)
    Document Type Miscellaneous Product
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC PAS 62647-3:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    PD IEC/TS 62647-2:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Mitigation of deleterious effects of tin
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
    DD IEC PAS 62647-3 : DRAFT SEP 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC PAS 62647-2:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    ASQ Q9000:2005 Quality Management Systems - Fundamentals And Vocabulary
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
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