IEC TR 61340-5-2 : 1.0

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ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE

Publisher: International Electrotechnical Committee

Published:

Available Formats: PDF - English - French, Hardcopy - English - French, PDF - English - French, Hardcopy - English - French
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Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Personnel safety
5 ESD control program
6 Automated handling equipment (AHE)
7 ESD control gloves and finger cots
8 Handtools
Annex A (informative) - Example ESD control program plan
based on IEC 61340-5-1
Annex B (informative) - ESD control element considerations
Bibliography

Abstract - (Show below) - (Hide below)

Pertains to activities that: manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and equipment with withstand voltages greater than or equal to 100 V HBM, 200 V CDM and 35 V for isolated conductors.

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Published
Document Type	Standard
Status	Withdrawn
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 101
Supersedes	IEC TS 61340-5-2 : 1ED 1999
Superseded By	IEC TR 61340-5-2:2018

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
UNE-CLC/TR 61340-5-2:2008	Identical
PKN-IEC/TR 61340-5-2:2020-04	Identical
VDE 0300-5-1 SUPP 1 : 2009 COR 1 2012	Identical
NEN NPR IEC CLC/TR 61340-5-2 : 2008 C1 2009	Identical
PKN-IEC/TR 61340-5-2:2020-04	Identical
DIN EN 61340-5-1 SUPP 1 : 2009 COR 1 2012	Identical
SR CLC/TR 61340-5-2:2008	Identical
BS PD CLC/TR 61340-5-2 : 2008	Identical
CEI 101-4 V1 : 2010	Identical
UNE-CLC/TR 61340-5-2:2008	Identical
CLC/TR 61340-5-2 : 2008	Identical
PKN CLC/TR 61340-5-2 : 2014	Identical
BS PD IEC TR 61340-5-2 : 2018	Identical
CEI CLC/TR 61340-5-2 : 2010	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 62435-1 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017)
I.S. EN 62435-2:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
BS PD IEC/TS 62239-2 : 2017	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN
BS EN 62435-2 : 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
I.S. EN 61340-4-6:2015	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
CEI EN 60747-16-5 : 2014	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
14/30267228 DC : 0	BS EN 61340-5-1 ED 2.0 - ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
BS IEC 60747-16.2 : 2001	SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS
15/30315510 DC : 0	BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
IEC 62435-4 : 1ED 2018	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 4: STORAGE
UTEC 96 029 : 2011	ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION
BS EN 61340-4-7 : 2017	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION (IEC 61340-4-7:2017)
DD IEC TS 62239 : 2003	PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
I.S. EN 62435-1:2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
08/30180398 DC : 0	BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
17/30355242 DC : 0	BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
DIN EN 61340-4-7 : 2018	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION (IEC 61340-4-7:2017)
BS EN 60286-3 : 2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
BS EN 62258-1 : 2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
14/30311058 DC : 0	BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
08/30190157 DC : DRAFT SEP 2008	BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS
09/30214337 DC : 0	BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
13/30286159 DC : 0	BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
14/30313506 DC : 0	BS EN 61340-4-7 - ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION
BS EN 61340-4-6 : 2015	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
BS EN 60747-16-5 : 2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
13/30286167 DC : 0	BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES
CEI EN 60747-16-3 : 2009	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
13/30267320 DC : 0	BS EN 61340-4-6 ED 2.0 - ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
BS EN 60747-16-4 : 2004	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
VDE 0300-4-7 : 2018	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION (IEC 61340-4-7:2017)
IEC TS 62239-2 : 1ED 2017	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 2: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COTS ASSEMBLY MANAGEMENT PLAN
BS EN 61340-5-1 : 2016	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
IEC 61340-4-7 : 2.0	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION
I.S. EN 62258-1:2010	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
EN 60747-16-3 : 2002 AMD 2 2017	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017)
EN 60747-16-4 : 2004 AMD 2 2017	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017)
BS EN 60747-16-1 : 2002	SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
IEC TR 61340-1 : 1.0	ELECTROSTATICS - PART 1: ELECTROSTATIC PHENOMENA - PRINCIPLES AND MEASUREMENTS
BS EN 60747-16-3 : 2002	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
CEI CLC/TR 62258-3 : 2007	SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
I.S. EN 60286-3:2013	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV))
I.S. EN 60747-16-3:2002	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
ARINC 606A : 2004	GUIDANCE FOR ELECTROSTATIC SENSITIVE DEVICE UTILIZATION AND PROTECTION
I.S. EN 61340-4-7:2017	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION
I.S. EN 60747-16-5:2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV))
EN 61340-4-7 : 2017	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION (IEC 61340-4-7:2017)
ISO 4586-5 : 2015	HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
I.S. EN 60747-16-4:2004	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
IEC 60747-16-2 : 1.1	SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS
IEC 61191-1 : 2.0	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
IEC TR 62258-3 : 2.0	SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
IEC TS 62239-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
VDI 2083-17 : 2013	CLEANROOM TECHNOLOGY - COMPATIBILITY OF MATERIALS WITH THE REQUIRED CLEANLINESS
IEC 61340-5-1 REDLINE : 2ED 2016	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
I.S. EN 61340-5-1:2016	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
IEC TS 62239 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
IEC 62258-1 : 2.0	SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
IEC 60747-16-5 : 1ED 2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
17/30365636 DC : 0	BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
BS PD IEC TS 62239-1 : 2015	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
IEC 60747-16-3 : 1.2	SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
BS EN 61191-1 : 2013	PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
15/30327712 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
11/30255124 DC : 0	BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
(INACTIVE RECORD)IEC 62435-1 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
IEC 60747-16-4:2004+AMD1:2009+AMD2:2017	SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
IEC 61340-5-1 : 2.0	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
IEC 62435-2 : 1ED 2017	ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
IEC 61340-4-6 : 2.0	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
IEC 60286-3 : 5.0	PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
EN 60747-16-5 : 2013	SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013)

Standards Referencing This Book - (Show below) - (Hide below)

IEC TS 61340-4-2 : 1ED 2013	ELECTROSTATICS - PART 4-2: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - ELECTROSTATIC PROPERTIES OF GARMENTS
IEC TS 60479-1 : 4.1	EFFECTS OF CURRENT ON HUMAN BEINGS AND LIVESTOCK - PART 1: GENERAL ASPECTS
IEC TR 61340-2-2 : 1.0	ELECTROSTATICS - PART 2-2: MEASUREMENT METHODS - SECTION 2: MEASUREMENT OF CHARGEABILITY
IEC 61340-5-3 : 2.0:2015	ELECTROSTATICS - PART 5-3: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - PROPERTIES AND REQUIREMENTS CLASSIFICATION FOR PACKAGING INTENDED FOR ELECTROSTATIC DISCHARGE SENSITIVE DEVICES
IEC 61340-4-9 : 2.0	ELECTROSTATICS - PART 4-9: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - GARMENTS
IEC 61340-4-7 : 2.0	ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION
IEC 61340-5-1 : 2.0	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
IEC 61340-2-3 : 2.0	ELECTROSTATICS - PART 2-3: METHODS OF TEST FOR DETERMINING THE RESISTANCE AND RESISTIVITY OF SOLID MATERIALS USED TO AVOID ELECTROSTATIC CHARGE ACCUMULATION
IEC 60749-27 : 2.1	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM)
ESDA/JEDEC JS-002 : 2014	ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - CHARGED DEVICE MODEL (CDM) - COMPONENT LEVEL
IEC 61340-4-3 : 1.0	ELECTROSTATICS - PART 4-3: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - FOOTWEAR
IEC 61340-4-1 : 2.1	ELECTROSTATICS - PART 4-1: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - ELECTRICAL RESISTANCE OF FLOOR COVERINGS AND INSTALLED FLOORS
IEC 60749-26 : 3.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 26: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - HUMAN BODY MODEL (HBM)
IEC 61340-2-1 : 2.0	ELECTROSTATICS - PART 2-1: MEASUREMENT METHODS - ABILITY OF MATERIALS AND PRODUCTS TO DISSIPATE STATIC ELECTRIC CHARGE
IEC 61340-4-5 : 1.0	ELECTROSTATICS - PART 4-5: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - METHODS FOR CHARACTERIZING THE ELECTROSTATIC PROTECTION OF FOOTWEAR AND FLOORING IN COMBINATION WITH A PERSON
IEC 61140 : 4.0:2016	PROTECTION AGAINST ELECTRIC SHOCK - COMMON ASPECTS FOR INSTALLATIONS AND EQUIPMENT
IEC 61010-1 : 3.1:2017	SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE - PART 1: GENERAL REQUIREMENTS
IEC TR 61340-1 : 1.0	ELECTROSTATICS - PART 1: ELECTROSTATIC PHENOMENA - PRINCIPLES AND MEASUREMENTS
IEC TS 60479-2 : 3.0	EFFECTS OF CURRENT ON HUMAN BEINGS AND LIVESTOCK - PART 2: SPECIAL ASPECTS
IEC 61340-4-6 : 2.0	ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS

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IEC TR 61340-5-2 : 1.0

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

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