IEC TR 62240:2005

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Objectives
5 Using devices outside the manufacturer's specified
  temperature ranges
  5.1 Device selection, usage and alternatives
  5.2 Device capability assessment
  5.3 Device quality assurance in wider temperature ranges
  5.4 Documentation
  5.5 Device identification
Annex A (informative) Device parameter re-characterisation
  A.1 Glossary of Symbols
  A.2 Rationale for parameter re-characterisation
  A.3 Capability assurance
  A.4 Quality assurance
  A.5 Factors to be considered in parameter re-characterisation
  A.6 References
Annex B (informative) Stress balancing
  B.1 General
  B.2 Glossary of symbols
  B.3 Stress balancing
  B.4 Application example
  B.5 Other notes
Annex C (informative) Parameter conformance assessment
  C.1 General
  C.2 Test plan
Annex D (informative) Higher assembly level testing
  D.1 General
  D.2 Process
Bibliography

Reports processes that exist for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. Covers applications in avionics in which only the performance of the device is an issue. The wider temperature ranges will be limited to those that do not compromise the system performance or application-specific reliability of the device.