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  • IEC TR 62866:2014

    Current The latest, up-to-date edition.

    Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  07-05-2014

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Electrochemical migration
    3 Test conditions and specimens
    4 Test methods
    5 Electrical tests
    6 Evaluation of failures and analysis
    Annex A (informative) - Life evaluation
    Annex B (informative) - Measurement of temperature-humidity
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2020 (11/2017)
    Document Type Technical Report
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    15/30331587 DC : 0 BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    EN 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
    CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
    I.S. EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-3-6:2001 Environmental testing - Part 3-6: Supporting documentation and guidance - Confirmation of the performance of temperature/humidity chambers
    IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    MIL-HDBK-781 Revision A:1996 RELIABILITY TEST METHODS, PLANS, AND ENVIRONMENTS FOR ENGINEERING DEVELOPMENT, QUALIFICATION AND PRODUCTION
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IEC 60068-2-67:1995 Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    ISO 4677-1:1985 Atmospheres for conditioning and testing Determination of relative humidity Part 1: Aspirated psychrometer method
    IPC TR 476 : A1997 ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES
    IEC 60068-3-5:2001 Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
    ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    MIL-STD-690 Revision D:2005 Failure Rate (FR) Sampling Plans and Procedures
    ASQ Z1.9:2003 (R2013) Sampling Procedures And Tables For Inspection By Variables For Percent Nonconforming
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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