Skip to content
Please enter a keyword to search

  • IEC TS 62647-21:2013

    Current The latest, up-to-date edition.

    Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  26-07-2013

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 General discussion of program management/systems
       engineering management concerns
    5 Requirements definition
    6 Use environment(s)
    7 Decision criteria
    8 Supplier's lead-free control plan
    9 Requalification/test plan
    10 Rework/repair and maintenance
    11 Risk management
    12 Cost
    13 Presentation to customer
    Annex A (informative) - Matrix of tier level
            versus associated risk
    Annex B (informative) - Links to the European Union
            Directives and Executive Order 13148
    Annex C (informative) - General program manager
            checklist for dealing with Pb-free issues
    Annex D (informative) - General manufacturing process
            assessment checklist for assessing supplier
            compliance to IEC/TS 62647-1
    Annex E (informative) - Recommended program language
            (subject to contractual agreements)
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC/TS 62647-21:2013(E) is designed to assist program management and/or systems engineering management in managing the transition to lead-free electronics to assure product reliability and performance. The basic principles delineated in this document can be used for program management and/or systems engineering management of any aerospace and/or high performance program. The annexes in the document describe tools that can be used in conjunction with this document. This document is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with IEC/TS 62647-1.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IEC PAS 62647-21. (08/2013) Stability date: 2019. (11/2017)
    Document Type Technical Specification
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
    IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    PD IEC/TS 62647-3:2014 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines

    Standards Referencing This Book - (Show below) - (Hide below)

    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    ASQ Q9000:2005 Quality Management Systems - Fundamentals And Vocabulary
    GEIA HB 0005-1 : 2006 PROGRAM MANAGEMENT/SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
    IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective