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  • IEC TS 62647-23:2013

    Current The latest, up-to-date edition.

    Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  07-10-2013

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviations
    4 Pb-free concerns
    5 Materials
    6 Soldering equipment
    7 General rework/repair considerations
    8 Pre-rework/repair processes
    9 Rework/repair processes
    10 Post-rework/repair processes
    Annex A (informative) - Termination finishes
    Annex B (informative) - Tin whiskers
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC/TS 62647-23:2013(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. The information contained within this document is based on the current knowledge of the industry at the time of publication.

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    Development Note Supersedes IEC PAS 62647-23. (10/2013) Stability date: 2019. (11/2017)
    Document Type Technical Specification
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IEC TS 62647-21:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    GEIA STD 0005-2 : 2012 MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
    IPC 1752 : A-2 MATERIALS DECLARATION MANAGEMENT
    IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
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