IEC TS 62686-1 : 2.0

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PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS

Publisher: International Electrotechnical Committee

Published: 22-04-2015

Available Formats: PDF - English, Hardcopy - English, PDF - English, Hardcopy - English
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Table of Contents - (Show below) - (Hide below)

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirements
Annex A (informative) - Test code (TC) information
Annex B (informative) - Cross-reference to STACK Specification
S/0001 revision 14
Bibliography

Abstract - (Show below) - (Hide below)

Specifies the minimum requirements for general purpose 'off the shelf' COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications.

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Published
Document Type	Standard
Status	Withdrawn
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 107
Supersedes	IEC PAS 62686-1 : 1.0
Superseded By	IEC TS 62686-1:2020

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
NEN NPR IEC/TS 62686-1 : 2015	Identical
BS PD IEC TS 62686-1 : 2015	Identical
SAC GB/T 37312.1:2019	Identical
BS PD IEC TS 62686-1 : 2015	Identical
NEN NPR IEC/TS 62686-1 : 2015	Identical
SAC GB/T 37312.1:2019	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS PD IEC TS 62564-1 : 2016	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
18/30373170 DC : 0	BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
IEC 62933-1 : 1ED 2018	ELECTRICAL ENERGY STORAGE (EES) SYSTEMS - PART 1: VOCABULARY
I.S. EN IEC 62933-1:2018	ELECTRICAL ENERGY STORAGE (EES) SYSTEMS - PART 1: VOCABULARY
EN IEC 62933-1 : 2018	ELECTRICAL ENERGY STORAGE (EES) SYSTEMS - PART 1: VOCABULARY (IEC 62933-1:2018)
IEC TS 62564-1 : 3.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
IEC TS 62668-2 : 2ED 2016	PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
IEC TS 62239-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
BS PD IEC TS 62239-1 : 2015	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
IEC TS 62933-5-1 : 1ED 2017	ELECTRICAL ENERGY STORAGE (EES) SYSTEMS - PART 5-1: SAFETY CONSIDERATIONS FOR GRID-INTEGRATED EES SYSTEMS - GENERAL SPECIFICATION
BS PD IEC TS 62668-2 : 2016	PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES
EIA STD 4899 : 2017-05	REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN

Standards Referencing This Book - (Show below) - (Hide below)

J STD 609 : A	MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
IEC 60749-20 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
IEC 60749-17 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 17: NEUTRON IRRADIATION
IEC 60749-38 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 38: SOFT ERROR TEST METHOD FOR SEMICONDUCTOR DEVICES WITH MEMORY
IEC 60749-8 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 8: SEALING
IEC 60749-21 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
MIL STD 883 : K	TEST METHOD STANDARD - MICROCIRCUITS
IEC 60749-25 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
IEC 60749-30 : 1.1	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
IEC 60749-5 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
AEC Q100 : REV H	FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS
UL 94 : 6	TESTS FOR FLAMMABILITY OF PLASTIC MATERIALS FOR PARTS IN DEVICES AND APPLIANCES
IEC 60749-4 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
IEC 61340-5-1 : 2.0	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
SAE J 1879 : 2014	HANDBOOK FOR ROBUSTNESS VALIDATION OF SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATIONS
IEC 60749-29 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
AEC Q100-005 : REV D1	NON-VOLATILE MEMORY PROGRAM/ERASE ENDURANCE, DATA RETENTION, AND OPERATING LIFE TEST
MIL PRF 19500 : P	SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
IEC 62374 : 1.0	SEMICONDUCTOR DEVICES - TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR GATE DIELECTRIC FILMS
IEC 62483 : 1ED 2013	ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHES ON SEMICONDUCTOR DEVICES
IEC 60749-36 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 36: ACCELERATION, STEADY STATE
ISO TS 16949 : 2009	QUALITY MANAGEMENT SYSTEMS - PARTICULAR REQUIREMENTS FOR THE APPLICATION OF ISO 9001:2008 FOR AUTOMOTIVE PRODUCTION AND RELEVANT SERVICE PART ORGANIZATIONS
RTCA DO 254 : 2000	DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE
MIL STD 750 : F	TEST METHODS FOR SEMICONDUCTOR DEVICES
IEC 60749-9 ED 2 : 2017	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING
IEC TS 62239-1 : 2.0	PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
J STD 033 : C-1	HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
ESDA/JEDEC JS-001 : 2017	ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
EIA 556 : B1999	ELECTRONIC INDUSTRIES ASSOCIATION: OUTER SHIPPING CONTAINER BAR CODE LABEL STANDARD
IEC 60749-33 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 33: ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
ASQ Z1.4:2003	Sampling Procedures And Tables For Inspection By Attributes
AEC Q101 : REV D1	FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR DISCRETE SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS
IEC TS 62564-1 : 3.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
IEC 60749-15 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
IEC 60749-26 : 3.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 26: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - HUMAN BODY MODEL (HBM)
IEC 60749-7 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES
ISO 14001:2015	ENVIRONMENTAL MANAGEMENT SYSTEMS - REQUIREMENTS WITH GUIDANCE FOR USE
J STD 035 : 0	ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS
IEC 62418 : 1.0	SEMICONDUCTOR DEVICES - METALLIZATION STRESS VOID TEST
AEC Q100-004 : REV D	IC LATCH-UP TEST
IEC 60749-34 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING
IEC 60749-6 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 6: STORAGE AT HIGH TEMPERATURE
ISO 9001:2015	QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS
IEC 62416 : 1.0	SEMICONDUCTOR DEVICES - HOT CARRIER TEST ON MOS TRANSISTORS
MIL STD 1580 : B	DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS
ESD S541 : 2008	PACKAGING MATERIALS FOR ESD SENSITIVE ITEMS
IEC 60749-3 : 2.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
IEC 62417 : 1.0	SEMICONDUCTOR DEVICES - MOBILE ION TESTS FOR METAL-OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTORS (MOSFETS)
IEC 60749-10 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 10: MECHANICAL SHOCK
IEC 60749-32 : 1.1	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 32: FLAMMABILITY OF PLASTIC-ENCAPSULATED DEVICES (EXTERNALLY INDUCED)
IEC 60695-11-5 : 2.0	FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
IEC 60749-14 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY)
IEC 60749-19 : 1.1	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
IEC 62415 : 1.0	SEMICONDUCTOR DEVICES - CONSTANT CURRENT ELECTROMIGRATION TEST
IEC 60749-22 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
J STD 020 : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IEC 60749-20-1 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
AEC Q100-001 : REV C	WIRE BOND SHEAR TEST
AEC Q100-010 : REV A	SOLDER BALL SHEAR TEST
IEC 60749-12 : 1.0	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 12: VIBRATION, VARIABLE FREQUENCY
IEC 62374-1 : 1.0	SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS
IEC 60749-23 : 1.1	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 23: HIGH TEMPERATURE OPERATING LIFE

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IEC TS 62686-1 : 2.0

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

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