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  • IPC 1066 : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    MARKING, SYMBOLS AND LABELS FOR IDENTIFICATION OF LEAD-FREE AND OTHER REPORTABLE MATERIALS IN LEAD-FREE ASSEMBLIES, COMPONENTS AND DEVICES

    Available format(s):  Hardcopy

    Superseded date:  01-05-2007

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 IEC
      2.3 European Parliament
      2.4 AIM
    3 TERMS AND DEFINITIONS
      3.1 2[nd] Level Interconnect
      3.2 2[nd] Level Interconnect Label
      3.3 Bar Code Label
      3.4 RoHS
      3.5 Halogen-Free
      3.6 Pb-Free (Lead-Free)
      3.7 Pb-Free Category
      3.8 Pb-Free Identification Label
      3.9 Pb-Free Symbol
    4 LABELS AND SYMBOLS
    5 LABELING CATEGORIES
      5.1 Solder Finish Categories
      5.2 Resin Category
      5.3 Conformal Coating Categories
    6 COMPONENT MARKING
      6.1 Size
      6.2 Color
      6.3 Font
      6.4 Maximum Safe Assembly Temperature
    7 PRINTED CIRCUIT BOARD/ASSEMBLY MARKING
      7.1 Category Hierarchy
      7.2 Location
      7.3 Color
      7.4 Size
      7.5 Method
      7.6 Marking Sequence
      7.7 Repair Marking
    8 SYMBOL AND LABELS
      8.1 Pb-Free Symbol
      8.2 Pb-Free Identification Label
          8.2.1 Size
          8.2.2 Color
      8.3 2nd Level Interconnect Label
          8.3.1 Components
          8.3.2 Assemblies
          8.3.3 Size
          8.3.4 Color
    Figures

    Abstract - (Show below) - (Hide below)

    Establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (pb-free) and are capable of providing Pb-free 2[nd] level interconnects, and for indicating certain types of Pb-free materials and the maximum allowable soldering temperatures.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in Manuals IPC M 104 & IPC M 106 (12/2004)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/TS 62564-1:2016 Process management for avionics. Aerospace qualified electronic components (AQEC) Integrated circuits and discrete semiconductors
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
    IPC E3TOOL : LATEST E3 SURVIVAL TOOLKIT
    IEC TS 62564-1:2016 Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    DD IEC TS 62564-1 : DRAFT SEP 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
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