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  • IPC 1601 : 0

    Current The latest, up-to-date edition.

    PRINTED BOARD HANDLING AND STORAGE GUIDELINES

    Available format(s): 

    Language(s): 

    Published date:  01-06-2016

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 INTRODUCTION
    2 APPLICABLE DOCUMENTS
    3 PRINTED BOARD FABRICATION AND PACKAGING (HANDLING)
    4 PACKAGING, STORAGE, AND SHIPMENT
    5 PRINTED BOARD RECEIVING, STORAGE AND ASSEMBLY
    APPENDIX A - Example Flowdown of Packaging/Handling
                 Requirements to a Printed Board Supplier
    APPENDIX B - Desiccant Required As a Function of Moisture
                 Barrier Bag (MBB) Size

    Abstract - (Show below) - (Hide below)

    Gives suggestions for proper handling, packaging materials and methods, environmental conditions, and storage for printed boards.

    General Product Information - (Show below) - (Hide below)

    Committee D-30
    Development Note Included in IPC C 105 & IPC C 1000. (09/2010) 2010 Edition is available in Chinese & German languages, See separate records. (07/2016) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 7801 : 0 REFLOW OVEN PROCESS CONTROL STANDARD
    EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
    IPC 4554 CHINESE : - SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 003 CHINESE : B SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 4556 : 0 SPECIFICATION FOR ELECTROLESS NICKEL/ELECTROLESS PALLADIUM/IMMERSION GOLD (ENEPIG) PLATING FOR PRINTED CIRCUIT BOARDS
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    IPC 9631 : 0 USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION
    NASA JSC 66491 : 2013 STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
    IPC 4554 : 0 SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
    I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
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