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  • IPC 1902 : 1998

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    GRID SYSTEMS FOR PRINTED CIRCUITS

    Available format(s): 

    Withdrawn date:  23-07-2013

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Confirms compatibility between printed circuits and components to be mounted on them at grid intersections. Contains discussion of the requirements for development of specialized modular grids in order to allow flexibility in future designs.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in CD-ROM format. (09/2005) Inactive for new design. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC S 816 : 0 SMT PROCESS GUIDELINE AND CHECKLIST
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC SM 780 : 0 COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
    IPC TA 723 : 1991 TECHNOLOGY ASSESSMENT HANDBOOK ON SURFACE MOUNTING
    IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
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