|
DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
|
IPC D 325 : A
|
DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS |
|
IPC 4121 : 0
|
GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS |
|
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
|
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
|
PD IEC/PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
|
IEC 61182-2:2006
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
|
BS EN 50155:2017
|
Railway applications. Rolling stock. Electronic equipment |
|
IPC 2251 : 0
|
DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS |
|
IPC 2224 : 0
|
SECTIONAL STANDARD FOR DESIGN OF PWBS FOR PC CARDS |
|
IPC 4130 : 0
|
SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN 'E' GLASS MATERIALS |
|
IPC A 610 SPANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 610 ROMANIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 600 SWEDISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
|
IPC 2225 : 0
|
SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES |
|
IPC A 600 JAPANESE : H
|
ACCEPTABILITY OF PRINTED BOARDS |
|
IPC A 600 CHINESE : G
|
ACCEPTABILITY OF PRINTED BOARDS |
|
MIL-PRF-55110 Revision H:2014
|
Printed Wiring Board, Rigid, General Specification for |
|
IPC A 600 GERMAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
|
IPC D 279 : 0
|
DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
|
IPC A 610 CZECH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC D 330 : 1992
|
DESIGN GUIDE MANUAL |
|
IPC A 600 POLISH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
|
IPC A 610 GERMAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 610 HINDI : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 600 RUSSIAN : H
|
ACCEPTABILITY OF PRINTED BOARDS |
|
IPC A 610 ESTONIAN : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 610 POLISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 610 DUTCH : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 610 KOREAN : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC 6202 : 0
|
IPC/JPCA PERFORMANCE GUIDE MANUAL FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS |
|
IPC 6010 SERIES : LATEST
|
IPC-6010 QUALIFICATION AND PERFORMANCE SERIES |
|
IPC FA 251 : 0
|
GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS |
|
IPC A 610 ITALIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC 2315 : 0
|
DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
|
IPC A 610 SWEDISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 610 HUNGARIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC 2141 : A
|
DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
|
IPC A 610 TURKISH : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 610 JAPANESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC A 600 FRENCH : H
|
ACCEPTABILITY OF PRINTED BOARDS |
|
IPC A 610 RUSSIAN : D
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
MIL STD 11991 : A
|
GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
|
IPC A 610 VIETNAMESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
|
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
|
IPC TR 551 : 1993
|
QUALITY ASSESSMENT OF PRINTED BOARDS USED FOR MOUNTING AND INTERCONNECTING ELECTRONIC COMPONENTS |
|
IPC 2615 : 0
|
PRINTED BOARD DIMENSIONS AND TOLERANCES |
|
IPC D 322 : 0
|
GUIDELINES FOR SELECTING PRINTED WIRING BOARD SIZES USING STANDARD PANEL SIZES |
|
IPC MC 790 : 0
|
GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION |
|
I.S. EN 50155:2017-11
|
RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
|
IPC 2581 : B
|
GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
|
IPC 6015 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES |
|
IEC PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
|
EN 50155:2017
|
Railway applications - Rolling stock - Electronic equipment |
|
IPC TR 578 : 1984
|
LEADING EDGE MANUFACTURING TECHNOLOGY REPORT |
|
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
|
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
|
IPC HDI 1 : LATEST
|
HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM |
|
BS IEC 61182-2:2006
|
Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
|
IPC TR 579 : 0
|
ROUND ROBIN RELIABILITY EVALUATION OF SMALL DIAMETER PLATED-THROUGH HOLES IN PWBS |
|
IPC J STD 026 : 0
|
SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
|
IPC J STD 028 : 0
|
PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |