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  • IPC 2222 : A

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS

    Available format(s):  Hardcopy

    Superseded date:  05-02-2021

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 GENERAL REQUIREMENTS
    4 MATERIALS
    5 MECHANICAL/PHYSICAL PROPERTIES
    6 ELECTRICAL PROPERTIES
    7 THERMAL MANAGEMENT
    8 COMPONENT AND ASSEMBLY ISSUES
    9 HOLE/INTERCONNECTIONS
    10 GENERAL CIRCUIT FEATURE REQUIREMENTS
    11 DOCUMENTATION
    12 QUALITY ASSURANCE

    Abstract - (Show below) - (Hide below)

    Pertains to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections.

    General Product Information - (Show below) - (Hide below)

    Committee D-30
    Development Note To be used in conjunction with IPC 2221. Supersedes IPC D 949 & IPC ML 910. Together with IPC 2221 & IPC 2223 supersedes IPC D 249 & IPC D 275. Included in IPC 2220, IPC C 106, IPC C 105 & IPC C 1000. (12/2010) Also available in German, Chinese & French Languages, See IPC 2222 GERMAN, CHINESE & FRENCH. (08/2015)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

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    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
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