DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
MIL-HDBK-1861 Revision B:2013
|
Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware |
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
BS EN 50155:2017
|
Railway applications. Rolling stock. Electronic equipment |
16/30282633 DC : 0
|
BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK |
MIL-PRF-50884 Revision F:2014
|
Printed Wiring Board, Flexible or Rigid-Flex, General Specification for |
IPC AJ 820 : A
|
ASSEMBLY AND JOINING HANDBOOK |
IPC J STD 001 SWEDISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL P 50884 : E
|
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
IPC J STD 001 RUSSIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 TURKISH : E2010
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 POLISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 9241 : 2016
|
GUIDELINES FOR MICROSECTION PREPARATION |
IPC 2611 : 0
|
GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION |
IPC 2612-1 : 0
|
SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING SYMBOL GENERATION METHODOLOGY |
IPC 2612 : 0
|
SECTIONAL REQUIREMENTS FOR ELECTRONIC DIAGRAMMING DOCUMENTATION (SCHEMATIC AND LOGIC DESCRIPTIONS) |
IPC 4553 : A
|
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC 6202 : 0
|
IPC/JPCA PERFORMANCE GUIDE MANUAL FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS |
IPC CH 65 : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
IPC FA 251 : 0
|
GUIDELINES FOR ASSEMBLY OF SINGLE- AND DOUBLE-SIDED FLEX CIRCUITS |
IPC CH 65 CHINESE : B
|
GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES |
MIL-DTL-917 Revision F:2014
|
ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR |
MIL-PRF-31032-4 Revision C:2017
|
PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
MIL-PRF-31032-3 Revision C:2017
|
PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING |
IPC FLXCSP0605-CD : 2005
|
IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS, CHIP SCALE PACKAGING AND RADIO FREQUENCY IDENTIFICATION |
IPC J STD 001 HUNGARIAN : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 GERMAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC FLXCSP0706-CD : 2006
|
IPC INTERNATIONAL CONFERENCE ON FLEXIBLE CIRCUITS AND CHIP SCALE PACKAGING |
IPC 4553 CHINESE : A
|
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS |
IPC 6013 GERMAN : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC 2614 : 0
|
SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION |
IPC J STD 001 ROMANIAN : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
MIL STD 11991 : A
|
GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
IPC J STD 001 DANISH : E
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
PD IEC/TS 62647-1:2012
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
I.S. EN 50155:2017-11
|
RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT |
IPC J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
NASA STD 5005 : 2013
|
STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
NASA KSC DE 512-SM : 2012
|
FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
EN 50155:2017
|
Railway applications - Rolling stock - Electronic equipment |
IEC TS 62647-1:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
IEC PAS 62647-1:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
PD IEC/PAS 62647-1:2011
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management |
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
BS EN 16602-70-12:2016
|
Space product assurance. Design rules for printed circuit boards |
EN 16602-70-12:2016
|
Space product assurance - Design rules for printed circuit boards |
ASME Y14.24 : 2012
|
TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |