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  • IPC 2226 : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS

    Available format(s):  Hardcopy

    Superseded date:  11-08-2023

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 GENERAL REQUIREMENTS
    4 MATERIALS
    5 MECHANICAL/PHYSICAL PROPERTIES
    6 ELECTRICAL PROPERTIES
    7 THERMAL MANAGEMENT
    8 COMPONENT AND ASSEMBLY ISSUES
    9 HOLES/INTERCONNECTIONS
    10 GENERAL CIRCUIT FEATURE
       REQUIREMENTS
    11 DOCUMENTATION
    12 QUALITY ASSURANCE

    Abstract - (Show below) - (Hide below)

    Sets up requirements and considerations for the design of organic and inorganic high density interconnect (HDI) printed boards and structures for component mounting and interconnections.

    General Product Information - (Show below) - (Hide below)

    Committee D-30
    Development Note To be used in conjunction with IPC 2221. (09/2005) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
    EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
    MIL-HDBK-1861 Revision B:2013 Selection and Use1 of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
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