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  • IPC 2581 : B

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY

    Available format(s):  Hardcopy

    Superseded date:  05-02-2021

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 CONTENT
    5 LOGISTIC HEADER
    6 HISTORY RECORD
    7 BOM (Material List)
    8 ELECTRONIC COMPUTER AIDED DESIGN (ECAD)
    9 APPROVED VENDOR LIST (AVL)
    10 GLOSSARY
    11 REFERENCE INFORMATION
    Appendix A - IPC-7351 Naming Convention for Land Patterns
    Appendix B - Panel Instance File
    Appendix C - Potential Reference Designator Assignment
                 for Non Electrical Items

    Abstract - (Show below) - (Hide below)

    Describes the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.

    General Product Information - (Show below) - (Hide below)

    Committee 2-10
    Development Note Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
    IPC 2501 : 0 DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
    BS EN 50155:2017 Railway applications. Rolling stock. Electronic equipment
    16/30282633 DC : 0 BS EN 50155 - RAILWAY APPLICATIONS - ELECTRONIC EQUIPMENT USED ON ROLLING STOCK
    EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC 2588 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
    IPC 2583 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
    IPC 2582 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC 7525 GERMAN : B STENCIL DESIGN GUIDELINE
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    I.S. EN 50155:2017-11 RAILWAY APPLICATIONS - ROLLING STOCK - ELECTRONIC EQUIPMENT
    IPC 7525 CHINESE : B STENCIL DESIGN GUIDELINES
    EN 50155:2017 Railway applications - Rolling stock - Electronic equipment
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    IPC 2584 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION
    IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
    IPC 7525 : B STENCIL DESIGN GUIDELINES
    I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))

    Standards Referencing This Book - (Show below) - (Hide below)

    ANSI Y14.5 : 1973 DIMENSIONING AND TOLERANCING FOR ENGINEERING DRAWINGS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC 2611 : 0 GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION
    DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
    IPC 2578 : 0 SECTIONAL REQUIREMENTS FOR SUPPLY CHAIN COMMUNICATION OF BILL OF MATERIAL AND PRODUCT DESIGN CONFIGURATION DATA - PRODUCT DATA EXCHANGE
    IPC D 325 : A DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
    ISO 10303-212:2001 Industrial automation systems and integration — Product data representation and exchange — Part 212: Application protocol: Electrotechnical design and installation
    IPC 2614 : 0 SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
    ANSI Z210.1 : LATEST METRIC PRACTICE GUIDE
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
    IPC 2524 : 0 PWB FABRICATION DATA QUALITY RATING SYSTEM
    IPC 2576 : 0 SECTIONAL REQUIREMENTS FOR ELECTRONICS MANUFACTURING SUPPLY CHAIN COMMUNICATION OF AS-BUILT PRODUCT DATA - PRODUCT DATA EXCHANGE (PDX)
    IPC 2511 : B GENERIC REQUIREMENTS FOR IMPLEMENTATION OF PRODUCT MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
    IPC 2571 : 2001 GENERIC REQUIREMENTS FOR ELECTRONIC MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX)
    IPC D 310 : C GUIDELINES FOR PHOTOTOOL GENERATION AND MEASUREMENT TECHNIQUES
    IPC 2501 : 0 DEFINITION FOR WEB-BASED EXCHANGE OF XML DATA
    ISO 10303-210:2011 Industrial automation systems and integration Product data representation and exchange Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
    IPC 4103 : A SPECIFICATION FOR BASE MATERIALS FOR HIGH SPEED/HIGH FREQUENCY APPLICATIONS
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