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GUIDELINES FOR ELECTRICALLY CONDUCTIVE SURFACE MOUNT ADHESIVES
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Published date: 01-07-1996
Publisher: Institute of Printed Circuits
1.0 SCOPE 1.1 Introduction 2.0 APPLICABLE DOCUMENTS 2.1 IPC3.0 BASIC TYPES AND FEATURES 3.1 Benefits and Limitations of Conductive Adhesives4.0 MATERIALS 4.1 Types of Polymers 4.2 Fillers5.0 BASIC TYPES OF CONDUCTIVE ADHESIVES 5.1 Intrinsically Conductive Polymers (ICP) 5.2 Isotropically Conductive Adhesives 5.3 Anisotropic Conductive Adhesives 5.4 Nonconductive Adhesives Used for Electrical Connections6.0 APPLICATION AND ASSEMBLY PROCESS 6.1 Applying Isotropic Pastes 6.2 Applying Anisotropic Pastes 6.3 Applying Anisotropic Films 6.4 Component Placement 6.5 Hardening the Adhesive 6.6 Special Operations7.0 REPAIR 7.1 Thermoplastic Systems 7.2 Thermosets 7.3 Anisotropics8.0 PERFORMANCE 8.1 Mechanical 8.2 Electrical 8.3 Chemical 8.4 Compatibility9.0 TESTING DIFFERENCES COMPARED TO SOLDER 9.1 Printability/Applicability 9.2 Hardening/Curing/Polymerization 9.3 Mechanical 9.4 Electrical 9.5 InspectionFiguresFigure 3-1 Metallurgic solder (shown only as tin for simplicity)Figure 3-2 Electrical paths in isotropic conductive adhesiveFigure 3-3 Isotropic conductive adhesive joint Figure 3-4 Anisotropic conductive adhesives junctionsFigure 3-5 Result of evaluating conductive adhesive using a screen designed for solder paste
Contains definitions for selecting electrically conductive adhesives (as alternatives to solder) for use in assembly of components to PCBs. Covers anisotropic types, thermosets, and thermoplastics.
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