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SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
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Published date: 01-05-1999
Publisher: Institute of Printed Circuits
1 SCOPE 1.1 General 1.2 Designation System 1.3 Application Levels2 APPLICABLE DOCUMENTS 2.1 IPC 2.2 American Society for Testing and Materials (ASTM) 2.3 Underwriters Laboratories (UL) 2.4 American National Standards Institute (ANSI)3 REQUIREMENTS 3.1 Terms and Definitions 3.2 Specification Sheets 3.3 Manufacturer's Quality Profile 3.4 Qualification (Characterization) Testing 3.5 Verification of Material Supplier's Quality System 3.6 Conflict 3.7 Materials 3.8 General Acceptability 3.9 Mechanical Requirements 3.10 Chemical Requirements 3.11 Electrical Requirements 3.12 Environmental Requirements 3.13 Non-Nutrient 3.14 Workmanship 3.15 Material Safety Data Sheets 3.16 Shelf Life 3.17 Marking4 QUALITY ASSURANCE PROVISIONS 4.1 Quality System 4.2 Responsibility for Inspection 4.3 Qualification (Characterization) Testing 4.4 Quality Conformance Inspection 4.5 Statistical Process Control (SPC)5 PREPARATION FOR DELIVERY 5.1 Packaging6 NOTES 6.1 Ordering Data 6.2 ReferencesAPPENDIX A
Describes various conductive and dielectric materials for use in fabricating HDI and microvias. Defines qualification and conformance requirements for materials such as photoimageable dielectric dry films and liquids, epoxy blends and coated foils.
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