1 SCOPE
2 APPLICABLE DOCUMENTS
3 REQUIREMENTS OF ENIG DEPOSIT
4 QUALITY ASSURANCE PROVISIONS
APPENDIX 1 - Terms and Definitions Not
Currently in IPC-T-50
APPENDIX 2 - ENIG Process Sequence
APPENDIX 3 - XRF Thickness Measurements
of Thin Au (ENIG): Recommendations
for Instrumentation (Detectors) and
Their Limitations
APPENDIX 4 - ENIG PWB Surface Finish
Wetting Balance Testing
APPENDIX 5 - IPC 4-14 SC ENIG Round
Robin Solder Spread Testing
APPENDIX 6 - Wire Bonding to ENIG
APPENDIX 7 - Through Hole Solderability
Testing
APPENDIX 8 - Evaluation of Electroless
Nickel Corrosion Due to Immersion
Gold Plating, Using 3000X Magnification
After Gold Stripping
APPENDIX 9-A - Cyanide Gold Stripping for
ENIG
APPENDIX 9-B - Test Method for Potassium
Iodide/Iodine (Non-Cyanide) ENIG Gold
Stripping Procedure
APPENDIX 9-C - Method for Stripping Gold
Plating from ENIG Finished PCBs by
Broad Beam Argon Ion Milling
APPENDIX 10 - Determination of Thickness
and Phosphorus Content In Electroless
Nickel (EN) Layers X-Ray Fluorescence
(XRF) Spectrometry [IPC-TM-650,
Method 2.3.44]
APPENDIX 11 - Phosphorus Content Measurement in
ENIG Using Electron Dispersive
Spectroscopy EDS - Initial Testing
APPENDIX 12 - Standard Developments Efforts of
Electroless Nickel Immersion Gold
APPENDIX 13 - Using Guard Bands or a Gauge
Correction Factor to Accommodate Type 1
Gauge Study Measurement Uncertainty