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  • IPC 6015 : 0

    Current The latest, up-to-date edition.

    QUALIFICATION AND PERFORMANCE SPECIFICATION FOR ORGANIC MULTICHIP MODULE MOUNTING AND INTERCONNECTING STRUCTURES

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-02-1998

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 SCOPE
         1.1 Scope
         1.2 Purpose
         1.3 Performance Classification
         1.4 Documentation Hierarchy
    2.0 APPLICABLE DOCUMENTS
         2.1 Mandatory Documents
         2.2 Supplemental Documents
    3.0 REQUIREMENTS
         3.1 General
         3.2 Materials Used in this Specification
         3.3 Visual Examination
         3.4 Dimensional Requirements
         3.5 Conductor Definition
         3.6 Structural Integrity Prior to Stress
         3.7 Structural Integrity After Thermal Stress
         3.8 Solder Resist (Solder Mask) Requirements
         3.9 Electrical Properties
         3.10 Environmental
         3.11 Special Requirements
         3.12 Repair
    4.0 QUALITY ASSURANCE
         4.1 General
         4.2 Quality Conformance Inspection
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Visual requirements for organic substrates used to interconnect chip components, specifically single-chip modules and multi-chip modules (MCM-L). This standard covers quality and reliability requirements for plating, conductors, structural integrity, electrical properties, insulation resistance, and more. Includes test methods.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IPC RF 245. (12/2001) To be used with IPC 6011. (06/2002) Included in IPC 6010 SERIES. (09/2003)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IPC 2225 : 0 SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES
    IPC 6010 SERIES : LATEST IPC-6010 QUALIFICATION AND PERFORMANCE SERIES
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    PD IEC/PAS 62647-1:2011 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Lead-free management
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC MC 790 : 0 GUIDELINES FOR MULTICHIP MODULE TECHNOLOGY UTILIZATION
    IPC PE 740 : 0 TROUBLESHOOTING FOR PRINTED BOARD MANUFACTURE AND ASSEMBLY
    IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
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