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  • IPC 7094 : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR FLIP CHIP AND DIE SIZE COMPONENTS

    Available format(s):  Hardcopy

    Superseded date:  13-09-2023

    Language(s):  English

    Published date:  14-02-2018

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS AND TECHNOLOGY OVERVIEW
    4 FLIP CHIP TECHNOLOGY
    5 FLIP CHIP POST FABRICATION PROCESSING
    6 FLIP CHIP INTERCONNECTING SUBSTRATES
    7 PACKAGE LEVEL STANDARDIZATION
    8 SYSTEM LEVEL ISSUES
    9 FLIP CHIP AND DIE SIZE DEVICE ASSEMBLY
    10 REQUIREMENTS FOR BOARD AND MODULE
       LEVEL RELIABILITY
    11 RELIABILITY PREDICTION MODELING
    12 VALIDATION AND QUALIFICATION TESTING
    13 SUPPLY CHAIN ISSUES
    APPENDIX A - Glossary
    APPENDIX B - Acronyms

    Abstract - (Show below) - (Hide below)

    Specifies the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Development Note Supersedes J STD 012. (01/2015) Included in the IPC C 1000 Collection. (05/2016)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
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