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  • IPC 7095 : C

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS

    Available format(s):  Hardcopy

    Superseded date:  22-02-2019

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 SELECTION CRITERIA AND MANAGING BGA IMPLEMENTATION
    4 COMPONENT CONSIDERATIONS
    5 PRINTED BOARDS AND OTHER MOUNTING STRUCTURES
    6 PRINTED CIRCUIT ASSEMBLY DESIGN CONSIDERATION
    7 ASSEMBLY OF BGAS ON PRINTED CIRCUIT BOARDS
    8 RELIABILITY
    9 DEFECT AND FAILURE ANALYSIS CASE STUDIES
    10 GLOSSARY AND ACRONYMS
    11 BIBLIOGRAPHY AND REFERENCES
    Appendix A - Process Control Characterization to Reduce
                 the Occurrence of Voids

    Abstract - (Show below) - (Hide below)

    Specifies the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 103 & IPC C 1000. (12/2013) Supersedes J STD 013. (01/2015) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

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    IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
    IPC J STD 001 SWEDISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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    IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    MIL-PRF-55110 Revision H:2014 Printed Wiring Board, Rigid, General Specification for
    IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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    IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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    IPC 7525 GERMAN : B STENCIL DESIGN GUIDELINE
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    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    I.S. EN 61191-6:2010 PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
    IPC 7525 CHINESE : B STENCIL DESIGN GUIDELINES
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    BS EN 61191-6:2010 Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
    IEC 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
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    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    EN 61191-6:2010 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
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    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
    IPC 9704 : A PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE
    IPC D 356 : B BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT
    IPC 4761 : 0 DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
    IPC 2611 : 0 GENERIC REQUIREMENTS FOR ELECTRONIC PRODUCT DOCUMENTATION
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    IPC TR 462 : 0 SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 2614 : 0 SECTIONAL REQUIREMENTS FOR BOARD FABRICATION DOCUMENTATION
    IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
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    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
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    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
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    IPC MF 150 : F AMD 1 METAL FOIL FOR PRINTED WIRING APPLICATIONS
    IPC 1601 : 0 PRINTED BOARD HANDLING AND STORAGE GUIDELINES
    IPC D 279 : 0 DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
    IPC 7525 : B STENCIL DESIGN GUIDELINES
    IPC 7711/21 : B REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES
    IPC 9701 : A PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
    IPC 4554 : 0 SPECIFICATION FOR IMMERSION TIN PLATING FOR PRINTED CIRCUIT BOARDS
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
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