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  • IPC 7525 : B

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    STENCIL DESIGN GUIDELINES

    Available format(s):  Hardcopy

    Superseded date:  18-11-2022

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 PURPOSE
    2 APPLICABLE DOCUMENTS
    3 STENCIL DESIGN
    4 STENCIL FABRICATION
    5 STENCIL MOUNTING
    6 STENCIL ORDERING
    7 STENCIL USER'S INSPECTION/VERIFICATION
    8 STENCIL CLEANING
    9 END OF LIFE
    APPENDIX A: EXAMPLE ORDER FORM

    Abstract - (Show below) - (Hide below)

    Acts as a guide for the design and fabrication of stencils for solder paste and surface-mount adhesive.

    General Product Information - (Show below) - (Hide below)

    Development Note Also available in German Language, See IPC 7525 GERMAN. (04/2013) Also available in Chinese Language, See IPC 7525 CHINESE. (02/2014)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC CM 770 : E COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS
    IPC 7527 : 0 REQUIREMENTS FOR SOLDER PASTE PRINTING
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 7093 CHINESE : - DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
    IPC 7527 GERMAN : - REQUIREMENTS FOR SOLDER PASTE PRINTING
    IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC 7526 : 2007 STENCIL AND MISPRINTED BOARD CLEANING HANDBOOK
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
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