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  • IPC 7912 : A

    Current The latest, up-to-date edition.

    END-ITEM DPMO FOR PRINTED CIRCUIT BOARD ASSEMBLIES

    Available format(s):  Hardcopy

    Language(s):  English

    Published date:  01-01-2004

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 OVERVIEW
       1.1 Scope
       1.2 Purpose
       1.3 Terms and Definitions
    2 APPLICABLE DOCUMENTS
    3 CATEGORIZATION OF OPPORTUNITIES AND DEFECTS
       3.1 Component Opportunities (oc)
       3.2 Component Defect (dc)
       3.3 Placement Opportunity (op)
       3.4 Placement Defect (dp)
       3.5 Termination Opportunity (ot)
       3.6 Termination Defect (dt)
       3.7 Listing of Countable Defects
    4 CALCULATION OF INDICES
       4.1 DPMO Index
       4.2 OMI
       4.3 Remarks
    APPENDIX A
    APPENDIX B
    Figures
    Figure 4-1 Calculations for Completed Electronic
               Assemblies: Conceptual Diagram
    Figure A-1 Example One
    Figure A-2 Example Two
    Tables
    Table A-1 Example One
    Table A-2 Example Two
    Table B-1 Component Defects
    Table B-2 Placement Defects
    Table B-3 Termination Defects

    Abstract - (Show below) - (Hide below)

    Provides consistent methodologies for calculating benchmark indices for DPMO Index, Component DPMO, Placement DPMO, Termination DPMO, and Overall Manufacturing Index (OMI). This document is for end-of-process benchmarking and it provides a definitive roadmap on 'how' to arrive at the industry's most relevant DPMO related indices.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
    IPC DPMO 202 : 2002 IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET
    IPC 9261 : A IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS
    IPC 9199 : 0 STATISTICAL PROCESS CONTROL (SPC) QUALITY RATING
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC DPMO 202 : 2002 IPC 7912/9261 END ITEM AND IN-PROCESS DPMO SET
    IPC A 610 : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
    IPC 9261 : A IN-PROCESS DPMO AND ESTIMATED YIELD FOR PCAS
    IPC 9191 : 0 GENERAL GUIDELINES FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL (SPC)
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