• IPC 9203 : 0

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE

    Available format(s):  Hardcopy

    Superseded date:  22-01-2024

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 INTRODUCTION
    2 APPLICABLE DOCUMENTS
    3 THE IPC B-52 TEST VEHICLE
    4 A WALK THROUGH OF IPC-9202
    5 OTHER USEFUL INFORMATION
    6 FINAL THOUGHTS

    Abstract - (Show below) - (Hide below)

    Addresses the IPC-B-52 standard test vehicle which can be used to evaluate optimize a manufacturing process or to provide objective evidence that a chosen manufacturing material set and manufacturing process are compatible from a cleanliness standpoint.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 103. (04/2013) Included in IPC C 108 & IPC C 1000. (07/2013) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    NASA GSFC STD 8002 : 2015 STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 52-G : 2006 CLEANLINESS AND RESIDUE EVALUATION TEST BOARD
    DEFSTAN 00-10/3(1986) : 1986 AMD 2 1993 GENERAL DESIGN AND MANUFACTURING REQUIREMENTS FOR SERVICE ELECTRONIC EQUIPMENT
    IPC J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC A 24 : LATEST SURFACE INSULATION RESISTANCE
    IPC 9201 : A SURFACE INSULATION RESISTANCE HANDBOOK
    IPC TR 467 : 0 SUPPORTING DATA AND NUMERICAL EXAMPLES FOR J-STD-001 (CONTROL OF FLUXES)
    IPC 9202 : 0 MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
    IPC 5704 : 0 CLEANLINESS REQUIREMENTS FOR UNPOPULATED PRINTED BOARDS
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