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  • IPC 9252 : A

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS

    Available format(s): 

    Superseded date:  04-10-2023

    Language(s): 

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
    3 TERMS AND DEFINITIONS
    4 TEST METHODOLOGIES
    5 TEST PROGRAM GENERATION
    6 ELECTRICAL TEST CERTIFICATION AND
      TRACEABILITY
    APPENDIX A - Other Tests and Considerations

    Abstract - (Show below) - (Hide below)

    Pertains to assist in selecting the test analyzer, test parameters, test data, and fixturing required to perform electrical test(s) on all unpopulated printed boards.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IPC ET 652. (12/2001) Included in IPC C 102, IPC C 105 & IPC C 1000. (12/2008) A2008 Edition is still available in Chinese language, See separate record. (09/2016) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    DSCC 11001 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    DSCC 11004 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
    DSCC 11005 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    MIL-PRF-50884 Revision F:2014 Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    MIL P 50884 : E PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    MIL-PRF-55110 Revision H:2014 Printed Wiring Board, Rigid, General Specification for
    MIL-PRF-31032-2 Revision C:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    MIL-PRF-31032-1 Revision D:2017 PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
    MIL-PRF-31032-4 Revision C:2017 PRINTED WIRING BOARD, RIGID FLEX OR FLEXIBLE, MULTILAYER, WITH PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
    MIL-PRF-31032-6 Revision B:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
    MIL-PRF-31032-3 Revision C:2017 PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED-THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING
    MIL-PRF-31032-5 Revision B:2017 PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC MI 660 : 1984 INCOMING INSPECTION OF RAW MATERIALS MANUAL
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    DSCC 11002 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    IPC D 356 : B BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    DSCC 11003 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IPC 9703 : 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
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