IPC 9702 : 0

Withdrawn

Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS

Available format(s):

Withdrawn date: 14-09-2023

Language(s):

Published date: 16-12-2021

Publisher: Institute of Printed Circuits

Table of Contents - (Show below) - (Hide below)

1 FOREWORD
2 INTRODUCTION
3 SCOPE
4 TERMS AND DEFINITIONS
5 SYMBOLS AND ABBREVIATED TERMS
6 SAMPLING
7 APPARATUS
  7.1 Universal Tester
  7.2 Strain Measurement Equipment
  7.3 Continuity Monitoring Equipment
8 PROCEDURE
  8.1 Component Sample
  8.2 Test Board Material
  8.3 Test Board Thickness and Metal Layer
  8.4 Test Board Surface Finish
  8.5 Test Board Land Pads
  8.6 Test Board Layout
  8.7 Test Board Daisy-Chain Links
  8.8 Board Assembly
  8.9 Storage
  8.10 Strain Gages
  8.11 Set-Up Test Board
  8.12 Four-Point Bend Test
9 FAILURE CRITERIA AND ANALYSIS
ANNEX A
ANNEX B

Abstract - (Show below) - (Hide below)

Describes a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations.

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Development Note	Included in IPC C 103 & IPC C 1000. (07/2008) Also available in Chinese langugae, See IPC 9702 CHINESE. (09/2011) Also available in Hardcopy format. (01/2018)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Withdrawn

Standards Referenced By This Book - (Show below) - (Hide below)

IPC 9704 CHINESE : -	PRINTED WIRING BOARD STRAIN GAGE TEST GUIDELINE
IPC 9707 : 0	SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS
IPC 9709 : 0	TEST GUIDELINES FOR ACOUSTIC EMISSION MEASUREMENT DURING MECHANICAL TESTING
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9701 CHINESE : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS
IPC 9704 : A	PRINTED CIRCUIT ASSEMBLY STRAIN GAGE TEST GUIDELINE

Standards Referencing This Book - (Show below) - (Hide below)

IPC 9501 : 0	PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
IPC D 279 : 0	DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES
IPC 9701 : A	PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS

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