Document Type
|
Standard |
ISBN
|
|
Pages
|
|
Published
|
|
Publisher
|
Institute of Printed Circuits
|
Status
|
Withdrawn |
IPC T 50 : M
|
TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
IPC 9703 : 0
|
IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY |
IPC 9708 : 0
|
TEST METHODS FOR CHARACTERIZATION OF PRINTED BOARD ASSEMBLY PAD CRATERING |
IPC D 279 : 0
|
DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
IPC 9701 : A
|
PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
IPC 9702 : 0
|
MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS |
IPC 9707 : 0
|
SPHERICAL BEND TEST METHOD FOR CHARACTERIZATION OF BOARD LEVEL INTERCONNECTS |
IPC 7095 : C
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
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