• IPC 9850 : 0

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    SURFACE MOUNT PLACEMENT EQUIPMENT CHARACTERIZATION

    Available format(s):  Hardcopy

    Superseded date:  23-07-2013

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 INTRODUCTION
    2 REFERENCED DOCUMENTS
    3 PLACEMENT PERFORMANCE METRIC
    4 LINE SUMMARY FORM IPC-9850-F
    5 MEASUREMENT SYSTEM ANALYSIS (MSA) CAPABILITY-FORM
      IPC-9850-F3
    6 TEST VEHICLES
    7 FORMS AND DIAGRAMS
    Appendix A - Capability Indexes
    Appendix B - Specification Limits for Cpk Values
    Appendix C - Guidelines for Adhesive Used for Machine
                 Capability Testing (Selection and Application)
    Appendix D - Suggested Methodologies for Measuring
                 Components Using an Optical CMM
    Appendix E - Component Centroid Locations for Panel
                 Population (relative to the lower left
                 fiducial)
    Appendix F - Component Location for CMM Verification
                 Panel
    Appendix G - How to Perform a GR&R Test Instruction
                 for Using the Gauge R&R Spreadsheet
    Appendix H - Reliability and Utilization Definitions
    Appendix I - Placement Verification Panel Carrier
    Appendix J - Instruction for Using The IPC-9850-MLTE.xls
                 Spreadsheets

    Abstract - (Show below) - (Hide below)

    Sets up the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine's placement capability and conformance to the specification while maintaining placement accuracy to placement throughput relationship.

    General Product Information - (Show below) - (Hide below)

    Development Note Includes one printed copy of the standard and a CD with support documentation. (12/2011) Also available in CD-ROM format. (07/2013)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 9262 : 2016 SPECIFICATION FOR CHARACTERIZATION AND VERIFICATION OF ASSEMBLY LEVEL AUTOMATIC OPTICAL INSPECTION EQUIPMENT

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
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