A single sided (4 up) pattern for use in evaluating the interaction of solder flux and solder paste residues on printed boards. This board was used in the Phase 3 portion of the test program evaluating alternative technologies used to eliminate CFCs in printed board assembly operations. The board contains four comb patterns with 0.4 mm lines and 0.5 mm spaces. A stencil pattern is also provided. (2 pcs 30 x 45 cm 1:1). Also available electronically in Gerber. If ordering Gerber please specify electronic format IPC-A-24.