• IPC CF 148 : A1998

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    RESIN COATED METAL FOR PRINTED BOARDS

    Available format(s): 

    Superseded date:  01-02-2008

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 Classification
      1.2 Quality/Performance Classification
      1.3 Presentation
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 National Conference of Standards Laboratories
      2.3 International Standards
    3 REQUIREMENTS
      3.1 Terms and Definitions
      3.2 Specification Sheets
      3.3 Qualification Testing
      3.4 Verification of Manufacturer's Quality System
      3.5 Precedence
      3.6 Materials
      3.7 General Acceptability Requirements
    4 GENERAL REQUIREMENTS
      4.1 Visual Properties
      4.2 Dimensional
      4.3 Processing Requirements
      4.4 Physical Requirements
      4.5 Chemical Requirements
      4.6 Electrical Requirements
      4.7 Environmental Requirements
      4.8 Workmanship
      4.9 Marking
      4.10 Material Safety
    5 QUALITY ASSURANCE PROVISIONS
      5.1 Quality System
      5.2 Responsibility for Inspection
      5.3 Qualification Testing
      5.4 Quality Conformance Inspection
      5.5 Statistical Process Control (SPC)
    6 PREPARATION FOR DELIVERY
      6.1 Packaging Materials
      6.2 Authorized Distributors
    7 NOTES
      7.1 Ordering Information for Resin
      7.2 New Materials

    Abstract - (Show below) - (Hide below)

    Establishes the requirements for metal foils coated with a resin or composite of resins on one side that are to be used for the fabrication of printed boards. An identification system is defined that describes the product with respect to: metal foil type; metal foil thickness; resin type; resin material thickness; end-of-item use classification.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in Manuals IPC S 100, IPC M 107, the IPC HDI 1 Compendium & the IPC E 500 Collection. (09/2003) Also available in CD-ROM format. (09/2005)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
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