• IPC CF 152 : B

    Current The latest, up-to-date edition.

    COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS

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    Published date:  01-12-1997

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
      1.1 Purpose
      1.2 Designation
      1.3 Presentation
    2 APPLICABLE DOCUMENTS
      2.1 IPC
      2.2 American Society for Testing Materials
      2.3 Military Standards
    3 REQUIREMENTS
      3.1 Terms and Definitions
      3.2 General Requirements - Acceptability
      3.3 Visual
      3.4 Dimensional
      3.5 Physical Requirements
      3.6 Processing Requirements - Treated Composite Foils
    4 QUALITY ASSURANCE PROVISIONS
      4.1 Quality Conformance Evaluations
      4.2 Classification of Inspections
      4.3 Qualification Inspection
      4.4 Quality Conformance Inspection
      4.5 Test Methods
      4.6 Statistical Process Control (SPC)
    5 PREPARATION FOR DELIVERY
      5.1 Shipping Requirements
      5.2 Documentation
      5.3 Marking
    6 NOTES
      6.1 Ordering Data
      6.2 References
    APPENDIX 1
    1 Overlay Volume Ratio
      1.A A Chemical Etch Method to Determine Copper Invar
          Copper Foil Ratio
      1.B Overlay Thickness Ratio for Copper/Invar/Copper
          Metal Core
    2 Determination of Coefficient of Thermal Expansion
      (CTE) Method
      2.B Fixturing of Thin Strip/Foil Materials for CTE
          Measurements
    Figures

    Abstract - (Show below) - (Hide below)

    Covers the requirements for copper/invar/copper and copper/molybdenum/copper, and three-layer composite materials. Lists visual (pits,dents,wrinkles), dimensional (width, length, thickness), physical (tensile, elongation, bow and twist) and bond integrity requirements. Includes slash sheets and test methods.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 107. (06/2008) Included in IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
    IPC TR 482 : 1976 NEW DEVELOPMENTS IN THIN COPPER FOILS
    IPC TR 484 : 1986 RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC MI 660 : 1984 INCOMING INSPECTION OF RAW MATERIALS MANUAL
    IPC 4101 CHINESE : C2009 SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    IPC 4101 GERMAN : C SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    I.S. EN 16602-70-11:2015 SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
    BS EN 16602-70-12:2016 Space product assurance. Design rules for printed circuit boards
    EN 16602-70-12:2016 Space product assurance - Design rules for printed circuit boards
    EN 16602-70-11:2015 Space product assurance - Procurement of printed circuit boards
    BS EN 16602-70-11:2015 Space product assurance. Procurement of printed circuit boards
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC 4101 : D SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC M 107 : LATEST STANDARDS FOR PRINTED BOARD MATERIALS MANUAL
    IPC TR 485 : 1985 RESULTS OF COPPER FOIL RUPTURE STRENGTH TEST ROUND ROBIN STUDY
    IPC TR 484 : 1986 RESULTS OF IPC COPPER FOIL DUCTILITY ROUND ROBIN STUDY
    IPC 4562 : A METAL FOIL FOR PRINTED BOARD APPLICATIONS
    IPC HDI 1 : LATEST HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM
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