DSCC 11001 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
BS EN 61182-2-2:2012
|
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
DSCC 11004 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
IPC 6017 : 0
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
DSCC 11005 : 0
|
PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
PD IEC/PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
IEC 61182-2:2006
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
IEC PAS 62250:2001
|
Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
EN 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IPC D 326 : A
|
INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
IPC FC 250 : A1986
|
SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
IPC 6012 RUSSIAN : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 610 DANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 SPANISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 ROMANIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6012 POLISH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 610 CZECH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 GERMAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HINDI : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 ESTONIAN : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 DUTCH : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 KOREAN : F2014
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2588 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
IPC 2583 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
IPC A 610 ITALIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 SWEDISH : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HUNGARIAN : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6013 GERMAN : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC 6012 FRENCH : C
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 2582 : 2007
|
SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
IPC D 949 : 1987
|
RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC PWB-CRT-SG : A2007
|
PCB DESIGNERS CERTIFICATION STUDY GUIDE |
IPC A 610 CHINESE : F
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 TURKISH : E2010
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 JAPANESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 RUSSIAN : D
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 VIETNAMESE : E
|
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6018 CHINESE : B
|
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
DSCC 11002 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
IPC 2615 : 0
|
PRINTED BOARD DIMENSIONS AND TOLERANCES |
IPC D 356 : B
|
BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT |
IEC 61182-1:1994
|
Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form |
IPC 2581 : B
|
GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
IEC PAS 61182-12:2014
|
Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
DSCC 11003 : 0
|
PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
I.S. EN 61182-7:1998
|
PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
IEC 61182-2-2:2012
|
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IEC PAS 62249:2001
|
Qualification and performance specification for flexible printed boards |
IEC 61182-7:1995
|
Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form |
BS IEC 61182-2:2006
|
Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
EN 61182-7 : 1995
|
PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
BS EN 61182-7:1996
|
Printed boards. Electronic data description and transfer Bare board electric test information in digital form |
I.S. EN 61182-2-2:2012
|
PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
ASME Y14.24 : 2012
|
TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
ASME Y14.100 : 2017
|
ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |