• IPC D 859 : 0

    Current The latest, up-to-date edition.

    DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS

    Available format(s): 

    Language(s): 

    Published date:  01-12-1989

    Publisher:  Institute of Printed Circuits

    Sorry this product is not available in your region.

    Add To Cart

    Abstract - (Show below) - (Hide below)

    Covers the requirements for the design of multilayer hybrid circuits that are based in industry manufacturing capabilities.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    ASME Y14.24 : 2012 TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC TF 870 : 0 QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS
    IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL
    IPC HM 860 : 0 SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS
    IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective