• IPC DR 572 : A

    Current The latest, up-to-date edition.

    DRILLING GUIDELINES FOR PRINTED BOARDS

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    Published date:  01-03-2007

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 SCOPE
    2 APPLICABLE DOCUMENTS
       2.1 IPC
    3 TERMS AND DEFINITIONS
       3.1 Aspect Ratio for Stack Drilling
       3.2 Backup Material
       3.3 Bird Nesting
       3.4 Burr
       3.5 Chip Load
       3.6 Connector Array
       3.7 Cutting Speed
       3.8 Debris
       3.9 Debris Packing
       3.10 Drill Bit Wander
       3.11 Drill Construction
       3.12 Drilled Hole Size (DHS)
       3.13 Dwell Time
       3.14 Entry Material
       3.15 Feed Rate
       3.16 Finished Hole Size (FHS)
       3.17 Good Hole
       3.18 Misregistration
       3.19 Oil Canning
       3.20 Plowing
       3.21 Pressure Foot
       3.22 Pressure Foot Lead
       3.23 Pressure Foot Pressure
       3.24 Pressure Foot Vacuum Paths
       3.25 Retract Rate (RTR)
       3.26 Rifling
       3.27 Roughness
       3.28 Spindle Run-Out
       3.29 Spindle Speed
       3.30 Spindle Sweep
       3.31 Straight Drill
       3.32 Undercut Drill
       3.33 Z-Axis Offset
    4 DRILL BITS
       4.1 Key Drill Bit Geometries
       4.2 Drill Bit Shank Diameter
       4.3 Drill Bit Inventory Control
       4.4 Drill Bit Inspection
       4.5 Drill Bit Replacement
       4.6 Drill Bit Cleaning
       4.7 Drill Bit Sharpening
       4.8 Ring Setting
    5 TOOLING
       5.1 Tooling to Obtain Good Registration
       5.2 Tooling Plates and Bushings
       5.3 Types of Tooling
            5.3.1 Hard Tooling
            5.3.2 Soft Tooling
            5.3.3 Sliding Pins
       5.4 Tooling Holes
       5.5 Pin Inspection
       5.6 Pin/Tooling Hole Interference Fit
    6 STACKING
       6.1 Stack Height
       6.2 Cleanliness
       6.3 Entry Material
       6.4 Backup Material
    7 DRILLING MACHINE - SET-UP AND MAINTENANCE
       7.1 Preventive Maintenance
       7.2 Environment
       7.3 Alignment
       7.4 Stability
       7.5 Machine Performance Checks
            7.5.1 Machine Accuracy Tests
            7.5.2 Hole Locations
            7.5.3 RPM Fall-Off
            7.5.4 Vacuum
            7.5.5 Spindle Run-Out
            7.5.6 Pressure Foot Lead
            7.5.7 Pressure Foot Inserts
            7.5.8 Pressure Foot Pressure
    8 DRILLING
       8.1 Materials
            8.1.1 Laminate Quality
            8.1.2 Cure
            8.1.3 Baking
            8.1.4 Reinforcement Materials
       8.2 Drilling Parameters
            8.2.1 Feed Rate
            8.2.2 Dwell Time
            8.2.3 Retract Rate (RTR)
            8.2.4 Peck Drilling
            8.2.5 Pulse Drilling
            8.2.6 Slot Drilling
            8.2.7 Hole Drilling Sequence
            8.2.8 Suggested Starting Conditions
            8.2.9 Factors Affecting Cutting Speed and Chip Load
       8.3 Drilling Depth into Backup Material
    9 DRILLED HOLES
       9.1 Standard Hole Sizes
       9.2 Hole Location
            9.2.1 Hole Location Tolerance
            9.2.2 Outer Layer Annular Ring
            9.2.3 Minimum Inner Layer Annular Ring
            9.2.4 Minimum Dielectric Spacing
       9.3 Hole Quality
            9.3.1 Drilled Hole Diameter Tolerance
            9.3.2 Entry and Exit Burrs
            9.3.3 Roughness
            9.3.4 Resin Smear
            9.3.5 Circularity (Roundness)
            9.3.6 Straightness
            9.3.7 Perpendicularity
            9.3.8 Debris Packing
            9.3.9 Nail Heading
            9.3.10 Haloing
            9.3.11 Delamination
    10 QUALITY ASSURANCE
       10.1 Drilling Capability Study
       10.2 Hole Location Evaluation
            10.2.1 First Article Inspection
            10.2.2 X-Ray Inspection
            10.2.3 Microsection Inspection
            10.2.4 Presence/Absence of Hole
       10.3 Hole Size Evaluation
       10.4 Hole Quality Evaluation
    11 TROUBLE SHOOTING

    Abstract - (Show below) - (Hide below)

    Provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. Also describes the following topics: - Drill Bits; - Tooling; - Drilling Stacked Materials; - Drilling Machines; - Drilling Operation; - Drilled Hole Quality and Trouble Shooting.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in IPC C 102. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC 2524 : 0 PWB FABRICATION DATA QUALITY RATING SYSTEM
    IPC NC 349 : 0 COMPUTER NUMERICAL CONTROL FORMATTING FOR DRILLERS AND ROUTERS
    IPC DR 570 : A GENERAL SPECIFICATION FOR 1/8 INCH DIAMETER SHANK CARBIDE DRILLS FOR PRINTED BOARDS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 6018 : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARDS
    IPC M 102 : LATEST FLEXIBLE CIRCUITS COMPENDIUM
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC DR 570 : A GENERAL SPECIFICATION FOR 1/8 INCH DIAMETER SHANK CARBIDE DRILLS FOR PRINTED BOARDS
    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
    IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
    IPC 6013 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS
    IPC 6012 : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
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