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  • IPC FC 232 : C1994 AMD 1 1995

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS

    Available format(s): 

    Superseded date:  01-05-2002

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Establishes the requirements for dielectric films coated with an adhesive on one side which are to be used as cover sheets for flexible printed wiring. The following topics are covered: base materials; type of reinforcement; method of reinforcement; type of adhesive; product classification. Coverage includes materials, qualification, applicable documents, miltary standards, chemical requirements, electrical requirements, environmental requirements, quality assurance provisions, chemical resistance, and preparation for delivery. Also contains detailed diagrams and tables.

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    Development Note D99 (PROPOSAL) is an official representative proposal (draft only). (07/2002)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IPC FC 250 : A1986 SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING
    IPC A 31 : LATEST FLEXIBLE RAW MATERIAL TEST PATTERN - FILM FORMAT
    IEC PAS 62293:2001 Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    MIL-STD-2118 Base Document:1984 FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR
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