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GUIDE TO SOLDER PASTE ASSESSMENT
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Available format(s): Hardcopy
Superseded date: 28-01-2018
Language(s): English
Published date:
Publisher: Institute of Printed Circuits
1 SCOPE 1.1 Purpose 1.2 Checklist 1.3 Terms and Definitions 1.4 Using Solder Paste2 APPLICABLE DOCUMENTS 2.1 IPC 2.2 Joint Industry Standards 2.3 Military 2.4 International Electrotechnical Commission Documents 2.5 Telcordia 2.6 ASTM3 SOLDERABILITY 3.1 Theory of Wetting 3.2 Degrees of Wetting 3.3 Wetting Measurement 3.4 Factors Affecting Solderability During Reflow Soldering Process 3.4.1 Land Surface Finish 3.4.1.1 Hot Air Solder Leveling (HASL) 3.4.1.2 Plating/Immersion Coating 3.4.1.3 Organic Solderability Preservatives (OSP) 3.4.2 Component Lead Composition/Finish 3.4.2.1 Base Metal 3.4.2.2 Coating Composition 3.4.2.2.1 Sn-Pb Coated Leads 3.4.2.2.2 Au Coated Leads 3.4.2.2.3 Pd or Pt Plated Leads 3.4.2.3 Lead Coating Processes 3.4.3 Reflow 3.4.4 Solder Paste 3.4.4.1 Flux 3.4.4.2 Solder Alloy 3.4.4.3 Powder Particle Size 3.4.5 Summary 3.5 Solderability Testing 3.5.1 Solder Paste Wetting Tests 3.5.2 Solderability Test Documents 3.5.2.1 Special Solderability Test Methods 3.5.3 Solderability Test Method Selection 4 PRINTING SOLDER PASTE 4.1 Printing Needs 4.2 Printing Variables 4.3 Primary Control Variables 4.4 Printing 4.4.1 Apparatus 4.4.2 Procedures 4.4.3 Evaluation 4.5 Solder Paste Print Quality Control Variables 4.5.1 PCB Variables 4.5.2 Solder Paste Variables 4.5.3 Stencil Variables 4.5.4 Screen Printer Variables 4.5.5 Environmental and Operator Variables5 ABILITY OF SOLDER PASTE TO RETAIN COMPONENTS (TACK) 5.1 Background 5.2 Tack Test Shortcomings 5.3 Tack Life 5.4 Increased Tack Strategies 5.5 Increased Tack Life Strategies 5.6 Control Variables 5.7 Improved Testing 5.7.1 Production Testing 5.7.2 User Test Guidelines 6 SLUMP 6.1 Slump Testing Apparatus 6.2 Test Procedure 6.3 Evaluation 6.3.1 Cold Slump 6.3.2 Hot Slump 6.3.3 Slump Performance 6.3.4 Visual Inspection 6.4 Differentiation 6.5 Major Control Variables7 SOLDER PASTE FUME COLLECTION AND DISPOSAL 7.1 Background 7.2 Flux Vapor Collection 7.3 Residue Toxicity 7.4 Collection System Maintenance 8 SOLDER BALLS 8.1 Solder Ball Tests 8.2 Forms of Solder Balling 8.2.1 Solder Beads 8.2.2 Solder Paste Segregation 8.2.3 8.2.4 Lack of Coalescence 8.2.5 Formulation Strategies 8.2.6 Process Strategies 8.3 Improved Testing 9 TOMBSTONING 9.1 Tombstone Causes 9.2 Minimizing Defects 10 CLEANABILITY OF SOLDER PASTES AND RESIDUES 10.1 Cleaning Methods and Materials11 COMPATIBILITY OF SOLDER PASTE FLUX RESIDUES (PROBE TESTABILITY) 11.1 Test Plan Overview 11.2 Approaches for Improved ATE-Compatibility 11.3 Main Characteristics 11.4 Major Control Variables 11.5 Residue Open Time 11.6 Temperature 11.7 Reflow Conditions 11.8 Test Points 11.8.1 Test Probe Design and ATE Equipment 11.8.2 Probe Build-up 11.8.3 Residue Dryness12 SHELF LIFE 12.1 Test Procedures 12.2 Evaluation 12.3 Control Variables APPENDIX A - Mass Reflow Assembly of 02\01 ComponentsAPPENDIX B - Qualification of Solder Beading and Tombstoning in Passive Devices using Designed ExperimentsAPPENDIX C - A Materials Based Solution for the Elimination of TombstonesFiguresTables
It is a guide to assess the applicability of a solder paste for a specific process, given the tremendous number of permutations of different materials, atmospheres and process variables.
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