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  • IPC HDI 1 : LATEST

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    HIGH DENSITY INTERCONNECT MICROVIA TECHNOLOGY COMPENDIUM

    Available format(s): 

    Withdrawn date:  23-07-2013

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Compiles the standards, specifications and guidelines which a company needs to produce high density interconnect (HDI) and microvia boards.

    General Product Information - (Show below) - (Hide below)

    Development Note Includes IPC 2220, IPC 2315, IPC 4104, IPC 6016, IPC 6801, IPC CF 148 and IPC CF 152. (03/2002) Also available in CD-ROM format. (09/2003)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
    IPC 2315 : 0 DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS
    IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
    IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC 2315 : 0 DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS
    IPC CF 148 : A1998 RESIN COATED METAL FOR PRINTED BOARDS
    IPC 6801 : 0 IPC/JPCA TERMS & DEFINITIONS, TEST METHODS, AND DESIGN EXAMPLES FOR BUILD-UP/HIGH DENSITY INTERCONNECT (HDI) PRINTED WIRING BOARDS
    IPC 4104 : 1999 SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS
    IPC CF 152 : B COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS
    IPC 6016 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS
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