1.0 SCOPE
1.1 Classifications
1.2 Types
1.3 Dimensions and Tolerances
1.4 Master Drawing
2.0 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Military
2.3 American Society of Mechanical Engineers
2.4 American Society for Testing and Materials
3.0 REQUIREMENTS
3.1 Terms and Definitions
3.2 General
3.2.1 Master Drawing
3.2.2 Production Master
3.3 Visual
3.3.1 Edges of Microwave Boards
3.3.2 Plated-through Hole, Visual Examination
3.3.3 Incoming material
3.3.4 Marking
3.3.5 Workmanship
3.3.6 Repair
3.3.7 Rework
3.4 Solderability
3.5 Dimensional
3.5.1 Plating (General)
3.5.2 Hole Pattern Accuracy
3.5.3 Conductor Pattern and Edges
3.5.4 Undercutting
3.5.5 Conductor Width and Spacing
3.5.6 Conductive Circuitry
3.5.7 Laminate Defects
3.5.8 Registration
3.5.9 Annular Ring (External)
3.6 Mechanical
3.6.1 Plating Adhesion
3.6.2 Lap Shear
3.6.3 Copper
3.7 Construction Integrity
3.7.1 Plated-through Hole Integrity
3.7.2 Dielectric Layer Thickness
3.7.3 Lifted Lands
3.7.4 Annular Ring (Internal)
3.7.5 Resin Smear
3.7.6 Thermal Stress
3.8 Circuitry
3.8.1 Circuitry Continuity (Qualification)
3.8.2 Circuitry Continuity (Production)
3.8.3 Circuit Shorts
3.9 Environment
3.9.1 Thermal Shock
3.9.2 Water Absorption
3.9.3 Moisture and Insulation Resistance
3.9.4 Ionic Cleanliness (Restivity of Solvent
Extract)
4.0 QUALITY ASSURANCE PROVISIONS
4.1 Statistical Process Control
4.2 Quality Conformance Evaluation
4.2.1 Responsibility for Inspection
4.2.2 Test Equipment and Inspection Facilities
4.2.3 Tolerances
4.3 Classification of Inspections
4.3.1 Materials Inspection
4.3.2 Supplier Qualification Inspection
4.4 Quality Conformance Inspection
4.4.1 Inspection of Product for Delivery
4.4.2 Lot Inspection (Each Production Lot)
4.4.3 Group B Inspection (Periodic)
4.4.4 Test Coupon
4.5 End Product Control
4.5.1 End Product Control Requirements
4.6 In Process Control
4.7 Process Parameter Control
4.7.1 Process Parameter Control Requirements
4.8 Reliability Assurance
5.0 PACKAGING
6.0 NOTES
6.1 Ordering Data
Figures
1 Adhesive band near exposed conductor
2 Conductor edge definition
3 Undercut and growth
4 External annular ring
5 Layer to layer registration and annular ring measurement
6 Location of test circuitry
7 Test coupon A, mm
8 Test coupon C, mm
9 Insulation resistance, coupon E, mm
10 Test coupon F, mm
A-1 Zero defects graphic illustration
Tables
1 Surface Finish Thickness
2 Percent of Allowable Conductor Width Deviations
3 Percent of Allowable Conductor Space Width Deviations
4 Percent of Allowable Conductor Width Reduction Caused by
Pin Holes
5 Percent of Reduction in Dielectric Material Thickness
6 Plated-through Hole Integrity
7 Minimum Annular Ring (Internal)
8 Insulation Resistance
9 Qualification Testing
10 Group A Inspection
11 Group B Inspection (Process Reliability)
12 Zero Defect Sampling Plan for Equipment Classes per
Lot Size
13 Test Frequency
A-1 Class 3 Defect Classification Criteria