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  • IPC HM 860 : 0

    Current The latest, up-to-date edition.

    SPECIFICATION FOR MULTILAYER HYBRID CIRCUITS

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    Published date:  01-01-1987

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Covers the qualification & performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of 3 or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may include passive elements.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-STD-2000 Revision A:1991 STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC D 859 : 0 DESIGN STANDARD FOR THICK FILM MULTILAYER HYBRID CIRCUITS
    IPC TF 870 : 0 QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC E 500 : LATEST IPC ELECTRONIC DOCUMENT COLLECTION
    IPC TF 870 : 0 QUALIFICATION AND PERFORMANCE OF POLYMER THICK FILM PRINTED BOARDS
    IPC DD 135 : 0 QUALIFICATION TESTING FOR DEPOSITED ORGANIC INTERLAYER DIELECTRIC MATERIALS FOR MULTICHIP MODULES
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