• IPC L 125 : A

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    PLASTIC SUBSTRATES, CLAD OR UNCLAD, FOR HIGH SPEED/HIGH FREQUENCY INTERCONNECTIONS

    Available format(s): 

    Superseded date:  01-12-2001

    Language(s): 

    Published date:  23-11-2012

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Covers the requirements for high speed/high frequency performance plastic substrates to be used primarily for the fabrication of printed wiring boards for microstrip, stripline, and high-speed digital electrical and electronic circuits. Applies to such a substrate which is 0.05mm (0.002 inch) or greater in thickness (as measured over the dielectric only).

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    IPC ML 950 : C1980 RIGID MULTILAYER PRINTED BOARDS, PERFORMANCE SPECIFICATION FOR,
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