IPC MF 150 : F AMD 1

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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METAL FOIL FOR PRINTED WIRING APPLICATIONS

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Superseded date: 01-05-2000

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Published date: 23-11-2012

Publisher: Institute of Printed Circuits

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Covers unsupported electrodeposited copper foil, aluminum or copper carrier supported electrodeposited copper foil and wrought copper foil suitable for subsequent use in printed boards. The following topics are covered: functional classes; copper weight; bonding treatment. AMD 1 IS AVAILABLE FROM IPC FOR #15.13

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Development Note	Supersedes IPC FC 150 (07/2004)
Document Type	Standard
ISBN
Pages
Published
Publisher	Institute of Printed Circuits
Status	Superseded
Superseded By	IPC 4562 : A
Supersedes	IPC FC 150 : E

Standards Referenced By This Book - (Show below) - (Hide below)

MIL P 13949 : G (1) SUPP 1	SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
QQ-S-571 Revision F:1994	SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
I.S. EN 16602-70-11:2015	SPACE PRODUCT ASSURANCE - PROCUREMENT OF PRINTED CIRCUIT BOARDS
IPC 7095 : C	DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
MIL-PRF-26514 Revision G:1995	POLYURETHANE FOAM, RIGID OR FLEXIBLE, FOR PACKAGING
MIL-S-13949 Revision H:1993	SHEET, PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
IEC PAS 62249:2001	Qualification and performance specification for flexible printed boards
EN 16602-70-11:2015	Space product assurance - Procurement of printed circuit boards
BS EN 16602-70-11:2015	Space product assurance. Procurement of printed circuit boards

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