• IPC QL 653 : A

    Current The latest, up-to-date edition.

    Certification of Facilities that Inspect/Test Printed Boards, Components & Materials

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    Published date:  01-11-1997

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1.0 SCOPE
        1.1 Scope
        1.2 Purpose
    2.0 APPLICABLE DOCUMENTS
        2.1 Institute for Interconnecting and Packaging
            Electronic Circuits (IPC)
        2.2 National Conference of Standards Laboratories
            2.2.1 ANSI/NCSL 540-1-1994
        2.3 Order Of Precedence
    3.0 REQUIREMENTS
        3.1 Terms and Definitions
            3.1.1 Inspection/Test Personnel
            3.1.2 Inspection/Test Facility
            3.1.3 Certifying Agency
        3.2 Certification
        3.3 Inspection/Test Program
        3.4 Documentation
            3.4.1 Documentation Submission
            3.4.2 Documentation at the Facility
        3.5 System Implementation
            3.5.1 Inspection/Test Personnel Certification
            3.5.2 Calibration
            3.5.3 Description of Inspection/Test Procedures
                   and Controls
            3.5.4 Traceability
            3.5.5 Handling Procedures
            3.5.6 Controlled Storage Area
            3.5.7 Inspection/Test Facility's Internal
                   Audit Activities
            3.5.8 Inspection/Test Reports
            3.5.9 Record Retention
            3.5.10 Safety Operating Procedures
        3.6 Certifying Agency Accessibility
            3.6.1 Confidentiality
    4.0 QUALITY ASSURANCE PROVISIONS
        4.1 Inspection/Test Conditions
        4.2 Certification Approval
            4.2.1 Documentation Submission
            4.2.2 Documentation Review
            4.2.3 Audit
            4.2.4 Notification of Audit Results
            4.2.5 Corrective Action
        4.3 Extent of Certification
            4.3.1 Additional Inspection/Test Capability
        4.4 Retention of Certification.
            4.4.1 Changes
            4.4.2 Inspection/Test Facility Internal Audits
        4.5 Re-certification
    5.0 PACKAGING
    6.0 NOTES
        6.1 General
        6.2 Organizational Structure
        6.3 Handbook for the Interpretation and Application
            of ANSI/NCSL 540-1-1994
        6.4 Subject (Key Word) Listing
    APPENDIX A
    APPENDIX B
    APPENDIX C
    APPENDIX D
    APPENDIX E

    Abstract - (Show below) - (Hide below)

    Establishes the qualification requirements for facilities that inspect/test printed boards, components and materials. This specification is intended to provide a minimum standardized basis for evaluation or auditing a technically oriented inspection/testing facility.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    MIL-PRF-50884 Revision F:2014 Printed Wiring Board, Flexible or Rigid-Flex, General Specification for
    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    MIL P 50884 : E PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    MIL-PRF-55110 Revision H:2014 Printed Wiring Board, Rigid, General Specification for
    IPC 7092 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR EMBEDDED COMPONENTS
    IPC 4411 : A SPECIFICATION AND CHARACTERIZATION METHODS FOR NONWOVEN PARA-ARAMID REINFORCEMENT
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC SM 840 CHINESE : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    IPC 4101 CHINESE : C2009 SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    IPC 4101 GERMAN : C SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS
    IPC QS 95 : 1993 GENERAL REQUIREMENTS FOR IMPLEMENTATION OF ISO 9000 QUALITY SYSTEMS
    IEC PAS 62214:2001 Generic performance specification for printed boards
    IEC PAS 62213:2001 Specification and characterization methods for nonwoven para-aramid reinforcement
    13/30295427 DC : 0 BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC 6011 GERMAN : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS
    IPC TM 650-MDP : 2012 IPC TEST METHOD DEVELOPMENT PACKET
    NASA JSC 66491 : 2013 STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
    IEC PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    IPC 6011 : 0 GENERIC PERFORMANCE SPECIFICATION FOR PRINTED BOARDS

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    MIL-STD-45662 Revision A:1988 CALIBRATION SYSTEMS REQUIREMENTS
    IPC TM 650 : 0 TEST METHODS MANUAL
    MIL HDBK 52 : B EVALUATION OF CONTRACTORS CALIBRATION SYSTEM
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